JPS63102250U - - Google Patents

Info

Publication number
JPS63102250U
JPS63102250U JP1986202693U JP20269386U JPS63102250U JP S63102250 U JPS63102250 U JP S63102250U JP 1986202693 U JP1986202693 U JP 1986202693U JP 20269386 U JP20269386 U JP 20269386U JP S63102250 U JPS63102250 U JP S63102250U
Authority
JP
Japan
Prior art keywords
island
lead
lead frame
integrated circuit
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986202693U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986202693U priority Critical patent/JPS63102250U/ja
Publication of JPS63102250U publication Critical patent/JPS63102250U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93Batch processes
    • H01L2224/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案のリードフレーム構造の平面
図、第2図及び、第3図は従来のリードフレーム
構造の平面図。 1……リードフレーム、2……アイランド、3
……リード。
FIG. 1 is a plan view of a lead frame structure of the present invention, and FIGS. 2 and 3 are plan views of a conventional lead frame structure. 1...Lead frame, 2...Island, 3
...Lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] アイランドと、リードを具備するリードフレー
ムにおいて、1枚のリードフレームに、1ケのア
イランドとそれに対応するリードのみを具備する
ことを特徴とする集積回路装置用リードフレーム
A lead frame for an integrated circuit device comprising an island and a lead, wherein one lead frame is provided with only one island and a lead corresponding to the island.
JP1986202693U 1986-12-23 1986-12-23 Pending JPS63102250U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986202693U JPS63102250U (en) 1986-12-23 1986-12-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986202693U JPS63102250U (en) 1986-12-23 1986-12-23

Publications (1)

Publication Number Publication Date
JPS63102250U true JPS63102250U (en) 1988-07-02

Family

ID=31167315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986202693U Pending JPS63102250U (en) 1986-12-23 1986-12-23

Country Status (1)

Country Link
JP (1) JPS63102250U (en)

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