JPS63172138U - - Google Patents
Info
- Publication number
- JPS63172138U JPS63172138U JP1987064334U JP6433487U JPS63172138U JP S63172138 U JPS63172138 U JP S63172138U JP 1987064334 U JP1987064334 U JP 1987064334U JP 6433487 U JP6433487 U JP 6433487U JP S63172138 U JPS63172138 U JP S63172138U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor device
- lead wire
- wire tip
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、本考案に係る半導体装置の要部切欠
裏面図、第２図は、その要部切欠側断面図、第３
図は、従来の半導体装置の側断面図である。
１１……基板、１２……素子、１３……リード
線、１４……ワイヤ、１５……樹脂、１７……ス
リツト。
FIG. 1 is a cutaway back view of the main part of a semiconductor device according to the present invention, FIG. 2 is a cutaway side sectional view of the main part, and FIG.
The figure is a side sectional view of a conventional semiconductor device. 11...Substrate, 12...Element, 13...Lead wire, 14...Wire, 15...Resin, 17...Slit.
Claims (1)
るリード線先端と、リード線先端と素子の電極を
結線したワイヤを、樹脂で埋設封止した半導体装
置において、前記基板の素子取付面とは反対側の
面に、スリツトを形成したことを特徴とする半導
体装置。 In a semiconductor device in which a substrate, an element attached to the substrate, a lead wire tip led out to the outside, and a wire connecting the lead wire tip and the electrode of the element are buried and sealed in resin, what is the element mounting surface of the substrate? A semiconductor device characterized in that a slit is formed on the opposite surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987064334U JPS63172138U (en) | 1987-04-28 | 1987-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987064334U JPS63172138U (en) | 1987-04-28 | 1987-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63172138U true JPS63172138U (en) | 1988-11-09 |
Family
ID=30900398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987064334U Pending JPS63172138U (en) | 1987-04-28 | 1987-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63172138U (en) |
-
1987
- 1987-04-28 JP JP1987064334U patent/JPS63172138U/ja active Pending