JPS6296857U - - Google Patents
Info
- Publication number
- JPS6296857U JPS6296857U JP18727385U JP18727385U JPS6296857U JP S6296857 U JPS6296857 U JP S6296857U JP 18727385 U JP18727385 U JP 18727385U JP 18727385 U JP18727385 U JP 18727385U JP S6296857 U JPS6296857 U JP S6296857U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- semiconductor device
- lead
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000008188 pellet Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図は、この考案の樹脂封止型半導体装置に
使用するリードフレームの一部を示す平面図、第
2図は、上記リードフレームを使用して製作し、
樹脂封止部を鎖線で示したこの考案の樹脂封止型
半導体装置の平面図、第3図および第4図は、上
記樹脂封止型半導体装置の使用例を示す斜視図、
第5図は、従来の樹脂封止型半導体装置を製作す
る場合に使用するリードフレームの一部を示す平
面図、第6図は、上記従来のリードフレームを使
用して製作した樹脂封止型半導体装置を示し、同
図Aは、その平面図、同図Bは、その側面図であ
る。
図において、16…樹脂封止型半導体装置、1
7…幅広の連結部、18…取付孔、19…脚部で
ある。
FIG. 1 is a plan view showing a part of a lead frame used in the resin-sealed semiconductor device of this invention, and FIG.
A plan view of the resin-sealed semiconductor device of this invention, in which the resin-sealed portion is shown by a chain line, and FIGS. 3 and 4 are perspective views showing an example of use of the resin-sealed semiconductor device,
FIG. 5 is a plan view showing a part of a lead frame used in manufacturing a conventional resin-sealed semiconductor device, and FIG. 6 is a resin-sealed type manufactured using the conventional lead frame. 1 shows a semiconductor device; FIG. 1A is a plan view thereof, and FIG. 2B is a side view thereof. In the figure, 16...resin-sealed semiconductor device, 1
7... Wide connecting part, 18... Mounting hole, 19... Leg part.
Claims (1)
ベース部に固着された半導体ペレツトの表面側の
電極と接続されるリード部とを設けたリードフレ
ームを使用し、前記半導体ペレツトが固着される
ベース部の裏面側が外部に露出するようにモール
ドした樹脂封止部を有する樹脂封止型半導体装置
において、前記樹脂封止部から外部へ導出するリ
ード部間が、幅広の連結部で一体的に接続されて
いることを特徴とする樹脂封止型半導体装置。 A lead frame having a base portion to which a semiconductor pellet is fixed and a lead portion connected to an electrode on the surface side of the semiconductor pellet fixed to this base portion is used. In a resin-sealed semiconductor device having a resin-sealed portion molded so that the back side is exposed to the outside, the lead portions led out from the resin-sealed portion are integrally connected by a wide connecting portion. A resin-sealed semiconductor device characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18727385U JPH021862Y2 (en) | 1985-12-06 | 1985-12-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18727385U JPH021862Y2 (en) | 1985-12-06 | 1985-12-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6296857U true JPS6296857U (en) | 1987-06-20 |
JPH021862Y2 JPH021862Y2 (en) | 1990-01-17 |
Family
ID=31137602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18727385U Expired JPH021862Y2 (en) | 1985-12-06 | 1985-12-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH021862Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2077579A4 (en) * | 2007-08-13 | 2014-10-08 | Onamba Co Ltd | Twin chip-mounted diode |
-
1985
- 1985-12-06 JP JP18727385U patent/JPH021862Y2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2077579A4 (en) * | 2007-08-13 | 2014-10-08 | Onamba Co Ltd | Twin chip-mounted diode |
Also Published As
Publication number | Publication date |
---|---|
JPH021862Y2 (en) | 1990-01-17 |