JPH0227728U - - Google Patents
Info
- Publication number
- JPH0227728U JPH0227728U JP10687988U JP10687988U JPH0227728U JP H0227728 U JPH0227728 U JP H0227728U JP 10687988 U JP10687988 U JP 10687988U JP 10687988 U JP10687988 U JP 10687988U JP H0227728 U JPH0227728 U JP H0227728U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- solder
- lead frame
- semiconductor device
- roughened
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は従来の実施例を示す断面図である。
１……ペレツト、２……ソルダー、３……リー
ドフレーム、４……ペレツト裏面。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a sectional view showing a conventional embodiment. 1...Pellet, 2...Solder, 3...Lead frame, 4...Back side of pellet.
Claims (1)
レツトと該リードフレームとを電気的及び物理的
に接続するためのソルダーとを有する半導体装置
において、該ソルダーに接する該ペレツトの裏面
が粗面化されていることを特徴とする半導体装置
。 In a semiconductor device having a lead frame on which a pellet is mounted and a solder for electrically and physically connecting the pellet and the lead frame, the back surface of the pellet in contact with the solder is roughened. A semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10687988U JPH0227728U (en) | 1988-08-11 | 1988-08-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10687988U JPH0227728U (en) | 1988-08-11 | 1988-08-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227728U true JPH0227728U (en) | 1990-02-22 |
Family
ID=31340787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10687988U Pending JPH0227728U (en) | 1988-08-11 | 1988-08-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227728U (en) |
-
1988
- 1988-08-11 JP JP10687988U patent/JPH0227728U/ja active Pending