JPS62140741U - - Google Patents
Info
- Publication number
- JPS62140741U JPS62140741U JP1986027708U JP2770886U JPS62140741U JP S62140741 U JPS62140741 U JP S62140741U JP 1986027708 U JP1986027708 U JP 1986027708U JP 2770886 U JP2770886 U JP 2770886U JP S62140741 U JPS62140741 U JP S62140741U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- lead frame
- region
- utility
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａは本考案の一実施例のリードフレーム
にペレツトをマウントした後の概略上面図、第１
図ｂは第１図ａの概略側面図、第２図ａは従来の
リードフレームにペレツトをマウントした後の概
略上面図、第２図ｂは第２図ａの概略側面図であ
る。
１…リードフレーム、２…半田、３…ペレツト
、４…囲い、５…樹脂。
Figure 1a is a schematic top view of one embodiment of the present invention after the pellet is mounted on the lead frame;
FIG. 2b is a schematic side view of FIG. 1a, FIG. 2a is a schematic top view after the pellet is mounted on a conventional lead frame, and FIG. 2b is a schematic side view of FIG. 2a. 1...Lead frame, 2...Solder, 3...Pellet, 4...Enclosure, 5...Resin.
Claims (1)
の外側に囲いを有することを特徴とする半導体装
置。 A semiconductor device characterized by having an enclosure outside a region of a lead frame in which a pellet is mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986027708U JPS62140741U (en) | 1986-02-26 | 1986-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986027708U JPS62140741U (en) | 1986-02-26 | 1986-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62140741U true JPS62140741U (en) | 1987-09-05 |
Family
ID=30829992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986027708U Pending JPS62140741U (en) | 1986-02-26 | 1986-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62140741U (en) |
-
1986
- 1986-02-26 JP JP1986027708U patent/JPS62140741U/ja active Pending