JPS62154655U - - Google Patents
Info
- Publication number
- JPS62154655U JPS62154655U JP4430286U JP4430286U JPS62154655U JP S62154655 U JPS62154655 U JP S62154655U JP 4430286 U JP4430286 U JP 4430286U JP 4430286 U JP4430286 U JP 4430286U JP S62154655 U JPS62154655 U JP S62154655U
- Authority
- JP
- Japan
- Prior art keywords
- wide
- solderability
- semiconductor device
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例で、第２図乃至第５
図は従来例図である。
Figure 1 shows one embodiment of the present invention, and Figures 2 to 5 show an embodiment of the present invention.
The figure is a diagram of a conventional example.
Claims (1)
広部を自動実装時の安定性および半田付け性の改
良に用いたことを特徴とする半導体装置。 A semiconductor device characterized in that a part of an external lead is formed wide, and the wide part is used to improve stability during automatic mounting and solderability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4430286U JPS62154655U (en) | 1986-03-25 | 1986-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4430286U JPS62154655U (en) | 1986-03-25 | 1986-03-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62154655U true JPS62154655U (en) | 1987-10-01 |
Family
ID=30861982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4430286U Pending JPS62154655U (en) | 1986-03-25 | 1986-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62154655U (en) |
-
1986
- 1986-03-25 JP JP4430286U patent/JPS62154655U/ja active Pending
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