JPS6355544U - - Google Patents
Info
- Publication number
- JPS6355544U JPS6355544U JP15023486U JP15023486U JPS6355544U JP S6355544 U JPS6355544 U JP S6355544U JP 15023486 U JP15023486 U JP 15023486U JP 15023486 U JP15023486 U JP 15023486U JP S6355544 U JPS6355544 U JP S6355544U
- Authority
- JP
- Japan
- Prior art keywords
- package
- mounting
- utility
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図は本考案のICパツケージ外形図、第2
図は従来ICパツケージ外形図、第3図は従来の
ICパツケージ取付け例を示す図、第4図は本考
案ICパツケージ取付け断面図である。
Figure 1 is an outline drawing of the IC package of the present invention, Figure 2 is
3 is a diagram showing an example of mounting the conventional IC package, and FIG. 4 is a sectional view of the IC package according to the present invention.
Claims (1)
ツケージ自身の三角形の切り込みをもつている事
を特徴とするパツケージ。 An IC package characterized by having a triangular notch in the package itself for IC mounting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15023486U JPS6355544U (en) | 1986-09-29 | 1986-09-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15023486U JPS6355544U (en) | 1986-09-29 | 1986-09-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6355544U true JPS6355544U (en) | 1988-04-14 |
Family
ID=31066191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15023486U Pending JPS6355544U (en) | 1986-09-29 | 1986-09-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6355544U (en) |
-
1986
- 1986-09-29 JP JP15023486U patent/JPS6355544U/ja active Pending