JPH0456347U - - Google Patents

Info

Publication number
JPH0456347U
JPH0456347U JP9997790U JP9997790U JPH0456347U JP H0456347 U JPH0456347 U JP H0456347U JP 9997790 U JP9997790 U JP 9997790U JP 9997790 U JP9997790 U JP 9997790U JP H0456347 U JPH0456347 U JP H0456347U
Authority
JP
Japan
Prior art keywords
sealed
external lead
semiconductor device
mounting board
textured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9997790U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9997790U priority Critical patent/JPH0456347U/ja
Publication of JPH0456347U publication Critical patent/JPH0456347U/ja
Pending legal-status Critical Current

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Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の第1の実施例の半導体装置の
実装時の断面図、第2図は本考案の第2の実施例
の断面図、第3図は従来の半導体装置の実装時の
断面図である。 1……外部リード端子先端部、2……外部リー
ド端子最先端部、3……接合材、4……実装基板
、5……外部リード端子裏側の接合部、6……封
入材。
FIG. 1 is a sectional view of a semiconductor device according to the first embodiment of the present invention when it is mounted, FIG. 2 is a sectional view of the second embodiment of the present invention, and FIG. 3 is a sectional view of a conventional semiconductor device when it is mounted. FIG. DESCRIPTION OF SYMBOLS 1... External lead terminal tip part, 2... External lead terminal tip end, 3... Bonding material, 4... Mounting board, 5... Bonding part on the back side of external lead terminal, 6... Encapsulating material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を封止した封止体から突出した外部
リードのうち、少なくとも実装基板と対向する表
面は、凹凸加工が施されていることを特徴とする
半導体装置。
1. A semiconductor device, wherein at least a surface of an external lead protruding from a sealed body in which a semiconductor element is sealed, which faces a mounting board, is textured.
JP9997790U 1990-09-25 1990-09-25 Pending JPH0456347U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9997790U JPH0456347U (en) 1990-09-25 1990-09-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9997790U JPH0456347U (en) 1990-09-25 1990-09-25

Publications (1)

Publication Number Publication Date
JPH0456347U true JPH0456347U (en) 1992-05-14

Family

ID=31842282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9997790U Pending JPH0456347U (en) 1990-09-25 1990-09-25

Country Status (1)

Country Link
JP (1) JPH0456347U (en)

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