JPH0418455U - - Google Patents
Info
- Publication number
- JPH0418455U JPH0418455U JP6030990U JP6030990U JPH0418455U JP H0418455 U JPH0418455 U JP H0418455U JP 6030990 U JP6030990 U JP 6030990U JP 6030990 U JP6030990 U JP 6030990U JP H0418455 U JPH0418455 U JP H0418455U
- Authority
- JP
- Japan
- Prior art keywords
- element body
- resin
- attaching
- heat sink
- flat surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例における樹脂封止型
半導体素子の構造を示しａは正面図、ｂは側面図
、第２図は第１図の本考案の樹脂封止型半導体素
子をプリント基板に実装した場合の断面図、第３
図は従来の樹脂封止型半導体素子の構造を示し、
ａは正面図、ｂは側面図、第４図は第３図の従来
の樹脂封止型半導体素子をプリント基板に実装し
た場合の断面図である。
１……素子本体、１１……素子本体の一面、１
３……素子本体の一面と反対側の他面、２……リ
ード端子、３……放熱板、６……クリツプ、９…
…凹凸部。
Fig. 1 shows the structure of a resin-sealed semiconductor element according to an embodiment of the present invention, a is a front view, b is a side view, and Fig. 2 is a printed version of the resin-sealed semiconductor element of the present invention shown in Fig. 1. Cross-sectional view when mounted on a board, 3rd
The figure shows the structure of a conventional resin-sealed semiconductor element.
4 is a front view, b is a side view, and FIG. 4 is a sectional view of the conventional resin-sealed semiconductor element of FIG. 3 mounted on a printed circuit board. 1...Element body, 11...One side of the element body, 1
3... One side of the element body and the other side opposite to it, 2... Lead terminal, 3... Heat sink, 6... Clip, 9...
...Uneven parts.
Claims (1)
から引き出されたリード端子とからなり、前記素
子本体の一面は放熱板取り付けのための平坦な面
からなり、この一面と反対側の他面に前記一面に
密着して置かれた放熱板と前記素子本体とを挟み
固定するクリツプの一端部がはめ込まれる凹凸部
が設けられていることを特徴とする樹脂封止型半
導体素子。 It consists of an element body whose entire surface is sealed with resin and lead terminals drawn out from the element body. One side of the element body is a flat surface for attaching a heat sink, and the other side opposite to this one side is a flat surface for attaching a heat sink. A resin-sealed semiconductor device, characterized in that it is provided with a concave-convex portion into which one end of a clip that clamps and fixes the heat dissipation plate and the device body placed in close contact with the one surface is fitted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6030990U JPH0418455U (en) | 1990-06-07 | 1990-06-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6030990U JPH0418455U (en) | 1990-06-07 | 1990-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0418455U true JPH0418455U (en) | 1992-02-17 |
Family
ID=31587563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6030990U Pending JPH0418455U (en) | 1990-06-07 | 1990-06-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0418455U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09121008A (en) * | 1995-10-25 | 1997-05-06 | Nec Corp | Package of semiconductor device |
| US11667812B2 (en) | 2015-06-22 | 2023-06-06 | Awi Licensing Llc | Soil and dirt repellent powder coatings |
| US12122934B2 (en) | 2023-04-24 | 2024-10-22 | Awi Licensing Llc | Soil and dirt repellent powder coatings |
-
1990
- 1990-06-07 JP JP6030990U patent/JPH0418455U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09121008A (en) * | 1995-10-25 | 1997-05-06 | Nec Corp | Package of semiconductor device |
| US11667812B2 (en) | 2015-06-22 | 2023-06-06 | Awi Licensing Llc | Soil and dirt repellent powder coatings |
| US12122934B2 (en) | 2023-04-24 | 2024-10-22 | Awi Licensing Llc | Soil and dirt repellent powder coatings |
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