JPH01157464U - - Google Patents
Info
- Publication number
- JPH01157464U JPH01157464U JP4708288U JP4708288U JPH01157464U JP H01157464 U JPH01157464 U JP H01157464U JP 4708288 U JP4708288 U JP 4708288U JP 4708288 U JP4708288 U JP 4708288U JP H01157464 U JPH01157464 U JP H01157464U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- notch
- corner
- molded
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図ａ及びｂはそれぞれ本考案の一実施例の
平面図及び断面図、第２図は従来例の平面図であ
る。
１……絶縁性基板、２……切欠き、３……導体
パターン、４……半導体部品、５……クリツプ端
子、６……樹脂封止体、７……傾斜部。
1A and 1B are a plan view and a sectional view of an embodiment of the present invention, respectively, and FIG. 2 is a plan view of a conventional example. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Notch, 3... Conductor pattern, 4... Semiconductor component, 5... Clip terminal, 6... Resin sealing body, 7... Inclined part.
Claims (1)
樹脂でモールドしてなる混成集積回路装置におい
て、前記絶縁性基板の一角に切欠きを有すること
を特徴とする混成集積回路。 1. A hybrid integrated circuit device comprising an insulating substrate and electronic components mounted on both surfaces thereof molded with resin, characterized in that the insulating substrate has a notch in one corner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4708288U JPH01157464U (en) | 1988-04-06 | 1988-04-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4708288U JPH01157464U (en) | 1988-04-06 | 1988-04-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01157464U true JPH01157464U (en) | 1989-10-30 |
Family
ID=31273312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4708288U Pending JPH01157464U (en) | 1988-04-06 | 1988-04-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01157464U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003078222A (en) * | 2001-08-31 | 2003-03-14 | Mitsumi Electric Co Ltd | Electronic equipment |
-
1988
- 1988-04-06 JP JP4708288U patent/JPH01157464U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003078222A (en) * | 2001-08-31 | 2003-03-14 | Mitsumi Electric Co Ltd | Electronic equipment |
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