JPS6355445U - - Google Patents

Info

Publication number
JPS6355445U
JPS6355445U JP14703086U JP14703086U JPS6355445U JP S6355445 U JPS6355445 U JP S6355445U JP 14703086 U JP14703086 U JP 14703086U JP 14703086 U JP14703086 U JP 14703086U JP S6355445 U JPS6355445 U JP S6355445U
Authority
JP
Japan
Prior art keywords
terminal
hole
conductive substrate
semiconductor module
checking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14703086U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14703086U priority Critical patent/JPS6355445U/ja
Publication of JPS6355445U publication Critical patent/JPS6355445U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図イ〜ハは夫々本考案の一実施例を示す図
、第2図は一般的な半導体モジユールの構成を示
す図、第3図は従来の半田付状態を拡大して示す
図である。 1…アルミニウム絶縁基板、2…導電性基板、
3…端子、4…半導体装置、5…樹脂モールド、
6…穴、7…突起。
FIGS. 1A to 1C are views showing an embodiment of the present invention, FIG. 2 is a view showing the configuration of a general semiconductor module, and FIG. 3 is an enlarged view of a conventional soldering state. . 1... Aluminum insulating substrate, 2... Conductive substrate,
3...Terminal, 4...Semiconductor device, 5...Resin mold,
6...hole, 7...protrusion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導電性基板に端子を半田付して成る半導体モジ
ユールにおいて、上記端子に半田付状態確認用の
穴を形成したことを特徴とする半導体モジユール
1. A semiconductor module comprising terminals soldered to a conductive substrate, characterized in that a hole is formed in the terminal for checking the soldering state.
JP14703086U 1986-09-25 1986-09-25 Pending JPS6355445U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14703086U JPS6355445U (en) 1986-09-25 1986-09-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14703086U JPS6355445U (en) 1986-09-25 1986-09-25

Publications (1)

Publication Number Publication Date
JPS6355445U true JPS6355445U (en) 1988-04-13

Family

ID=31060025

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14703086U Pending JPS6355445U (en) 1986-09-25 1986-09-25

Country Status (1)

Country Link
JP (1) JPS6355445U (en)

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