JPS6289175U - - Google Patents
Info
- Publication number
- JPS6289175U JPS6289175U JP18075785U JP18075785U JPS6289175U JP S6289175 U JPS6289175 U JP S6289175U JP 18075785 U JP18075785 U JP 18075785U JP 18075785 U JP18075785 U JP 18075785U JP S6289175 U JPS6289175 U JP S6289175U
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- package
- lead terminal
- integrated circuit
- microwave integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図〜第３図は本考案の第１〜第３実施例を
示す図、第４図〜第６図は第１〜第２の従来例を
示す図である。
第１図〜第３図において、１……電子デバイス
、１ａ，１ｂ……リード端子、２……止めネジ、
３……取付筐体、４，５……絶縁性基板、６，７
……電極パターン、１０，１１……接続用金リボ
ンである。
1 to 3 are views showing first to third embodiments of the present invention, and FIGS. 4 to 6 are views showing first to second conventional examples. In Figures 1 to 3, 1...electronic device, 1a, 1b...lead terminal, 2...set screw,
3...Mounting housing, 4, 5...Insulating board, 6,7
. . . Electrode pattern, 10, 11 . . . Gold ribbon for connection.
Claims (1)
ロ波集積回路基板に実装する場合において、電子
デバイスのリード端子をパツケージ近傍の根元部
分を一部残して切り落とし、該リード端子の根元
部分と基板上の電極とをこれら両者間に金リボン
をたわませた状態でボンデイングして接続したこ
とを特徴とする電子デバイスとマイクロ波集積回
路との接続構造。 When mounting an electronic device mounted on a package on a microwave integrated circuit board, the lead terminal of the electronic device is cut off leaving a part of the root part near the package, and the root part of the lead terminal and the electrode on the board are connected. A connection structure between an electronic device and a microwave integrated circuit, characterized in that the connection is made by bonding a gold ribbon between the two in a bent state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18075785U JPS6289175U (en) | 1985-11-26 | 1985-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18075785U JPS6289175U (en) | 1985-11-26 | 1985-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6289175U true JPS6289175U (en) | 1987-06-08 |
Family
ID=31125005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18075785U Pending JPS6289175U (en) | 1985-11-26 | 1985-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6289175U (en) |
-
1985
- 1985-11-26 JP JP18075785U patent/JPS6289175U/ja active Pending
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