JPH01123358U - - Google Patents
Info
- Publication number
- JPH01123358U JPH01123358U JP2050188U JP2050188U JPH01123358U JP H01123358 U JPH01123358 U JP H01123358U JP 2050188 U JP2050188 U JP 2050188U JP 2050188 U JP2050188 U JP 2050188U JP H01123358 U JPH01123358 U JP H01123358U
- Authority
- JP
- Japan
- Prior art keywords
- flat package
- utility
- integrated circuit
- scope
- arc shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の一実施例を実装した場合の断
面図、第２図は従来のフラツト・パツケージ型Ｉ
Ｃを実装した場合の断面図である。
１…実装基板、２…ＩＣ本体、３…リード端子
、４…はんだ、１０…フラツト・パツケージ型Ｉ
Ｃ。
Figure 1 is a sectional view of an embodiment of the present invention, and Figure 2 is a conventional flat package type I.
FIG. 1... Mounting board, 2... IC body, 3... Lead terminal, 4... Solder, 10... Flat package type I
C.
Claims (1)
とを特徴とするフラツト・パツケージ型集積回路
。 A flat package integrated circuit characterized by having lead terminals bent into an arc shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2050188U JPH01123358U (en) | 1988-02-17 | 1988-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2050188U JPH01123358U (en) | 1988-02-17 | 1988-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123358U true JPH01123358U (en) | 1989-08-22 |
Family
ID=31236922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2050188U Pending JPH01123358U (en) | 1988-02-17 | 1988-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123358U (en) |
-
1988
- 1988-02-17 JP JP2050188U patent/JPH01123358U/ja active Pending