JPH031571U - - Google Patents
Info
- Publication number
- JPH031571U JPH031571U JP6032089U JP6032089U JPH031571U JP H031571 U JPH031571 U JP H031571U JP 6032089 U JP6032089 U JP 6032089U JP 6032089 U JP6032089 U JP 6032089U JP H031571 U JPH031571 U JP H031571U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- electronic component
- recess
- mounting structure
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 239000003990 capacitor Substances 0.000 description 3
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の実施例で、金属基板に電解コ
ンデンサを装着した場合の斜視図、第２図乃至第
７図は本考案の他の実施例で、金属基板に電解コ
ンデンサを装着する種々の態様を示す斜視図、第
８図は電子部品として電解コンデンサを金属基板
への装着する従来例を示す斜視図である。
１１……金属基板、１２……電解コンデンサ（
電子部品）、１３……リード端子、１４……配線
電極、２０……凹部。
Fig. 1 shows an embodiment of the present invention, which is a perspective view of an electrolytic capacitor mounted on a metal substrate, and Figs. FIG. 8 is a perspective view showing a conventional example of mounting an electrolytic capacitor as an electronic component on a metal substrate. 11... Metal substrate, 12... Electrolytic capacitor (
electronic components), 13...lead terminal, 14...wiring electrode, 20...recess.
Claims (1)
リード端子を、該金属基板上の配線電極に接続し
てなる金属基板の実装構造において、該金属基板
の一部に前記電子部品が嵌入する凹部を形成し、
該凹部に該電子部品を装着することを特徴とする
金属基板の部品実装構造。 In a metal substrate mounting structure in which an electronic component is mounted on a metal substrate and a lead terminal of the electronic component is connected to a wiring electrode on the metal substrate, the electronic component is fitted into a part of the metal substrate. forming a recess;
A component mounting structure for a metal substrate, characterized in that the electronic component is mounted in the recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6032089U JPH031571U (en) | 1989-05-26 | 1989-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6032089U JPH031571U (en) | 1989-05-26 | 1989-05-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031571U true JPH031571U (en) | 1991-01-09 |
Family
ID=31587582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6032089U Pending JPH031571U (en) | 1989-05-26 | 1989-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031571U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009104461A (en) * | 2007-10-24 | 2009-05-14 | Aruze Corp | Bill processing apparatus |
-
1989
- 1989-05-26 JP JP6032089U patent/JPH031571U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009104461A (en) * | 2007-10-24 | 2009-05-14 | Aruze Corp | Bill processing apparatus |