JPH0410362U - - Google Patents
Info
- Publication number
- JPH0410362U JPH0410362U JP5105190U JP5105190U JPH0410362U JP H0410362 U JPH0410362 U JP H0410362U JP 5105190 U JP5105190 U JP 5105190U JP 5105190 U JP5105190 U JP 5105190U JP H0410362 U JPH0410362 U JP H0410362U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- electronic component
- hole
- solder joint
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例によるリード端子
構造を有する電子部品の実装状態を示す斜視図、
第２図Ａ，Ｂは各々この考案の一実施例及び従来
のはんだ接合部を示す断面図、並びに第３図は従
来のリード端子構造を有する電子部品の実装状態
を示す斜視図である。
図において、１はパツケージ、２はホール付リ
ード端子、２０はホール、３は基板、４は電極、
５ははんだ接合部である。なお、図中、同一符号
は同一又は相当部分を示す。
FIG. 1 is a perspective view showing a mounted state of an electronic component having a lead terminal structure according to an embodiment of the invention;
FIGS. 2A and 2B are cross-sectional views showing an embodiment of this invention and a conventional solder joint, respectively, and FIG. 3 is a perspective view showing a mounting state of an electronic component having a conventional lead terminal structure. In the figure, 1 is a package, 2 is a lead terminal with a hole, 20 is a hole, 3 is a substrate, 4 is an electrode,
5 is a solder joint. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
のリード端子において、リード端子のはんだ接合
部にホールを設けたことを特徴とする電子部品の
リード端子。 A lead terminal for an electronic component which is connected to an electrode of a substrate by soldering, characterized in that a hole is provided in the solder joint of the lead terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5105190U JPH0410362U (en) | 1990-05-15 | 1990-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5105190U JPH0410362U (en) | 1990-05-15 | 1990-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0410362U true JPH0410362U (en) | 1992-01-29 |
Family
ID=31570140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5105190U Pending JPH0410362U (en) | 1990-05-15 | 1990-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410362U (en) |
-
1990
- 1990-05-15 JP JP5105190U patent/JPH0410362U/ja active Pending