JPH0260218U - - Google Patents
Info
- Publication number
- JPH0260218U JPH0260218U JP14081988U JP14081988U JPH0260218U JP H0260218 U JPH0260218 U JP H0260218U JP 14081988 U JP14081988 U JP 14081988U JP 14081988 U JP14081988 U JP 14081988U JP H0260218 U JPH0260218 U JP H0260218U
- Authority
- JP
- Japan
- Prior art keywords
- component
- lead wires
- component body
- electrode portions
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図乃至第３図は本考案による表面実装電子
部品の一実施例を示す図であり、第１図は斜視図
、第２図は平面図、第３図は側面図、第４図は第
１図乃至第３図に示した表面実装電子部品を基板
に実装した状態を示す側面図、第５図は従来の表
面実装電子部品を示す斜視図、第６図は第５図に
示した表面実装電子部品を基板に実装した状態を
示す側面図である。
１……誘電体セラミツク、２……外部電極、３
……応力緩衝部、４……基板、５……半田。
1 to 3 are views showing one embodiment of the surface-mounted electronic component according to the present invention, in which FIG. 1 is a perspective view, FIG. 2 is a plan view, FIG. 3 is a side view, and FIG. 1 to 3 are side views showing the state in which the surface mount electronic components are mounted on a board, FIG. 5 is a perspective view showing the conventional surface mount electronic components, and FIG. 6 is the same as shown in FIG. 5. FIG. 2 is a side view showing a state in which surface-mounted electronic components are mounted on a board. 1... Dielectric ceramic, 2... External electrode, 3
...Stress buffer, 4...Substrate, 5...Solder.
Claims (1)
電極部にリード線を接続された表面実装電子部品
において、 前記各電極部に接続されたリード線が表面に沿
つて部品本体側に折り曲げられ、各リード線が、
互いに接触することなく、部品本体の表面に沿つ
て少なくとも一回以上巻回されたことを特徴とす
る表面実装電子部品。[Claims for Utility Model Registration] A surface mount electronic component having electrode portions on opposing end surfaces of a component body and having lead wires connected to each electrode portion, wherein the lead wires connected to each of the electrode portions are connected to the surface of the component body. The lead wires are bent toward the component body along the
A surface-mounted electronic component characterized in that the component is wound at least once along the surface of the component body without contacting each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14081988U JPH0260218U (en) | 1988-10-27 | 1988-10-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14081988U JPH0260218U (en) | 1988-10-27 | 1988-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260218U true JPH0260218U (en) | 1990-05-02 |
Family
ID=31405340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14081988U Pending JPH0260218U (en) | 1988-10-27 | 1988-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260218U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8223471B2 (en) | 2009-01-20 | 2012-07-17 | Tdk Corporation | Multilayer capacitor |
-
1988
- 1988-10-27 JP JP14081988U patent/JPH0260218U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8223471B2 (en) | 2009-01-20 | 2012-07-17 | Tdk Corporation | Multilayer capacitor |
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