JPH01164673U - - Google Patents
Info
- Publication number
- JPH01164673U JPH01164673U JP5981388U JP5981388U JPH01164673U JP H01164673 U JPH01164673 U JP H01164673U JP 5981388 U JP5981388 U JP 5981388U JP 5981388 U JP5981388 U JP 5981388U JP H01164673 U JPH01164673 U JP H01164673U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- surface mount
- solder pad
- connecting portion
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 1
Description
第１図は本考案の一実施例による表面実装用端
子を備えた実装部品を回路基板に取付けた状態の
斜視図、第２図は第１図の実装部品の側面図、第
３図は第１図の実装部品に用いた表面実装用端子
の接続部の拡大斜視図、第４図は回路基板の上に
表面実装用端子の接続部を乗せた状態の断面図、
第５図は第４図の回路基板のハンダパツドと接続
部とをハンダ付けした状態の説明図、第６図は第
５図のハンダパツトと接続部とが位置ずれしてハ
ンダ付けされた状態の説明図、第７図は本考案の
他の実施例による表面実装用端子の説明図、第８
図は従来の表面実装用端子を備えた実装部品を回
路基板に取付けた状態の斜視図、第９図は第８図
の実装部品の側面図、第１０図は回路基板の上に
表面実装用端子の接続部を乗せた状態の断面図、
第１１図は第１０図の回路基板のハンダパツドと
端子の接続部とをハンダ付けした状態の説明図、
第１２図はハンダパツドと接続部とが位置ずれし
てハンダ付けされた状態の説明図である。
１；表面実装用端子、３；インシユレータ、７
；接続部、９；回路基板、１１；実装部品、１３
；ハンダパツド、１５；ハンダ、１９；テーパ面
。
FIG. 1 is a perspective view of a mounting component equipped with surface mounting terminals according to an embodiment of the present invention attached to a circuit board, FIG. 2 is a side view of the mounting component of FIG. 1, and FIG. Figure 1 is an enlarged perspective view of the connection part of the surface mount terminal used in the mounted component; Figure 4 is a sectional view of the connection part of the surface mount terminal placed on the circuit board;
Fig. 5 is an explanatory diagram of the state in which the solder pads and the connection parts of the circuit board shown in Fig. 4 are soldered, and Fig. 6 is an illustration of the state in which the solder pads and the connection parts in Fig. 5 are soldered with their positions shifted. 7 are explanatory diagrams of surface mount terminals according to other embodiments of the present invention, and FIG.
The figure is a perspective view of a mounted component equipped with a conventional surface mount terminal attached to a circuit board, Figure 9 is a side view of the mounted component of Figure 8, and Figure 10 is a surface mount component mounted on a circuit board. Cross-sectional view with the terminal connection section mounted,
FIG. 11 is an explanatory diagram of the circuit board shown in FIG. 10 in which the solder pad and the terminal connection part are soldered;
FIG. 12 is an explanatory diagram of a state in which the solder pad and the connecting portion are soldered with their positions shifted. 1; Surface mounting terminal, 3; Insulator, 7
; Connection part, 9; Circuit board, 11; Mounting component, 13
;Solder pad, 15;Solder, 19;Tapered surface.
Claims (1)
付け接続される表面実装用端子において、上記ハ
ンダパツドの上面に対向しかつ上記回路基板に沿
つてのびた接続部を有し、該接続部の横断面を、
下端が狭く上端が広い楔形に作つたことを特徴と
する表面実装用端子。 A surface mount terminal that is placed on a solder pad on a circuit board and connected by soldering has a connecting portion facing the upper surface of the solder pad and extending along the circuit board, and the cross section of the connecting portion is
A surface mount terminal characterized by being wedge-shaped with a narrow bottom end and a wide top end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5981388U JPH01164673U (en) | 1988-05-07 | 1988-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5981388U JPH01164673U (en) | 1988-05-07 | 1988-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01164673U true JPH01164673U (en) | 1989-11-16 |
Family
ID=31285552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5981388U Pending JPH01164673U (en) | 1988-05-07 | 1988-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01164673U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015090809A (en) * | 2013-11-06 | 2015-05-11 | 住友電装株式会社 | Connector for board |
| WO2021107114A1 (en) * | 2019-11-28 | 2021-06-03 | 京セラ株式会社 | Wiring base, package for storing semiconductor element, and semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63239851A (en) * | 1987-03-27 | 1988-10-05 | Hitachi Ltd | Electronic device |
-
1988
- 1988-05-07 JP JP5981388U patent/JPH01164673U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63239851A (en) * | 1987-03-27 | 1988-10-05 | Hitachi Ltd | Electronic device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015090809A (en) * | 2013-11-06 | 2015-05-11 | 住友電装株式会社 | Connector for board |
| WO2021107114A1 (en) * | 2019-11-28 | 2021-06-03 | 京セラ株式会社 | Wiring base, package for storing semiconductor element, and semiconductor device |
| JPWO2021107114A1 (en) * | 2019-11-28 | 2021-06-03 |