JPS6247171U - - Google Patents
Info
- Publication number
- JPS6247171U JPS6247171U JP13902985U JP13902985U JPS6247171U JP S6247171 U JPS6247171 U JP S6247171U JP 13902985 U JP13902985 U JP 13902985U JP 13902985 U JP13902985 U JP 13902985U JP S6247171 U JPS6247171 U JP S6247171U
- Authority
- JP
- Japan
- Prior art keywords
- pads
- view
- integrated circuit
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図ａは本考案の実施例のプリント基板を示
す平面図、第１図ｂ，ｃは第１図ａのプリント基
板に集積回路を接続した状態を示す平面図および
その側面図、第１図ｄ，ｅは第１図ｂの接続部分
を詳細に示す平面図およびその側面図、第２図ａ
は従来のプリント基板のパツドを示す平面図、第
２図ｂ，ｃは第２図ａのプリント板に集積回路を
接続した状態を示す平面図、およびその側面図、
第２図ｄ，ｅは第２図ｂの接続部分を詳細に示す
平面図およびその側面図である。
１０……プリント基板、１１……集積回路実装
用パツド、２０……フラツト・パツケージ型集積
回路、２１……集積回路リード、３０……半田、
４０……オームメータ。
1a is a plan view showing a printed circuit board according to an embodiment of the present invention; FIGS. 1b and 1c are a plan view and a side view of the printed circuit board shown in FIG. Figures d and e are a plan view and side view showing the connection part in Figure 1 b in detail, and Figure 2 a.
2 is a plan view showing a pad of a conventional printed circuit board, FIGS. 2b and 2c are plan views showing a state in which an integrated circuit is connected to the printed board of FIG. 2a, and a side view thereof,
FIGS. 2d and 2e are a plan view and a side view showing the connecting portion of FIG. 2b in detail. 10... Printed circuit board, 11... Integrated circuit mounting pad, 20... Flat package integrated circuit, 21... Integrated circuit lead, 30... Solder,
40...Ohmmeter.
Claims (1)
ドとそれぞれ電気的に接続されるパツドを有する
プリント基板において、前記パツドの各々が２つ
の長方形のパツドにより構成されていることを特
徴とするプリント基板。 1. A printed circuit board having pads each electrically connected to a plurality of leads of a flat package integrated circuit, wherein each of the pads is constituted by two rectangular pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13902985U JPS6247171U (en) | 1985-09-10 | 1985-09-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13902985U JPS6247171U (en) | 1985-09-10 | 1985-09-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6247171U true JPS6247171U (en) | 1987-03-23 |
Family
ID=31044552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13902985U Pending JPS6247171U (en) | 1985-09-10 | 1985-09-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6247171U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01205498A (en) * | 1988-02-10 | 1989-08-17 | Toyo Commun Equip Co Ltd | Printed wiring pattern and detecting method for non-soldering |
-
1985
- 1985-09-10 JP JP13902985U patent/JPS6247171U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01205498A (en) * | 1988-02-10 | 1989-08-17 | Toyo Commun Equip Co Ltd | Printed wiring pattern and detecting method for non-soldering |