JPH0229557U - - Google Patents
Info
- Publication number
- JPH0229557U JPH0229557U JP10791288U JP10791288U JPH0229557U JP H0229557 U JPH0229557 U JP H0229557U JP 10791288 U JP10791288 U JP 10791288U JP 10791288 U JP10791288 U JP 10791288U JP H0229557 U JPH0229557 U JP H0229557U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- external connection
- pads
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 210000000078 claw Anatomy 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案に係る混成集積回路を示す側面
図、第２図は本考案に係る混成集積回路の回路面
を拡大して示す平面図、第３図は要部を拡大して
示す断面図である。
１…基板、１ａ…側部、２…導体パターン、４
…第一の半田付け用パツド、５…第二の半田付け
用パツド、６…リード、６ａ，６ｂ…爪片、７…
半田。
Fig. 1 is a side view showing a hybrid integrated circuit according to the present invention, Fig. 2 is a plan view showing an enlarged circuit surface of the hybrid integrated circuit according to the invention, and Fig. 3 is a cross section showing an enlarged view of the main parts. It is a diagram. DESCRIPTION OF SYMBOLS 1...Substrate, 1a...Side part, 2...Conductor pattern, 4
...first soldering pad, 5...second soldering pad, 6...lead, 6a, 6b...claw piece, 7...
solder.
Claims (1)
接続用端子が、基板の回路側に形成されたパツド
に半田付けされてなる混成集積回路において、前
記基板の裏面側における各外部接続用端子と対応
する各部位に半田付け用パツドを形成し、このパ
ツドと外部接続用端子とを半田付けしたことを特
微とする混成集積回路。 In a hybrid integrated circuit in which a plurality of external connection terminals sandwiching the side edges of the substrate from both sides are soldered to pads formed on the circuit side of the substrate, each external connection terminal on the back side of the substrate A hybrid integrated circuit characterized in that soldering pads are formed at each corresponding portion, and the pads and external connection terminals are soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10791288U JPH0229557U (en) | 1988-08-18 | 1988-08-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10791288U JPH0229557U (en) | 1988-08-18 | 1988-08-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0229557U true JPH0229557U (en) | 1990-02-26 |
Family
ID=31342757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10791288U Pending JPH0229557U (en) | 1988-08-18 | 1988-08-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229557U (en) |
-
1988
- 1988-08-18 JP JP10791288U patent/JPH0229557U/ja active Pending