JPS61156268U - - Google Patents

Info

Publication number
JPS61156268U
JPS61156268U JP3914185U JP3914185U JPS61156268U JP S61156268 U JPS61156268 U JP S61156268U JP 3914185 U JP3914185 U JP 3914185U JP 3914185 U JP3914185 U JP 3914185U JP S61156268 U JPS61156268 U JP S61156268U
Authority
JP
Japan
Prior art keywords
pad
printed wiring
wiring board
utility
scope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3914185U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3914185U priority Critical patent/JPS61156268U/ja
Publication of JPS61156268U publication Critical patent/JPS61156268U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a,b,cは本考案による第1の実施例
の印刷配線板とその主要部の接続用パツドの平面
図及び断面図。第2図は本考案の第2の実施例の
平面図。第3図は本考案の第3の実施例の平面図
。第4図a,b,cは従来例の印刷配線板の接続
用パツドの平面図である。 1……基板、2……接続用パツド、2a……(
接続用パツドの)はがれ部分、3……接続回路、
4……導通孔。
FIGS. 1a, b, and c are a plan view and a cross-sectional view of a printed wiring board according to a first embodiment of the present invention and connection pads that are the main parts thereof. FIG. 2 is a plan view of a second embodiment of the present invention. FIG. 3 is a plan view of a third embodiment of the present invention. FIGS. 4a, 4b, and 4c are plan views of connection pads of a conventional printed wiring board. 1... Board, 2... Connection pad, 2a... (
Peeling part of the connection pad, 3...Connection circuit,
4... Conduction hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面実装型部品接続用パツドを有する印刷配線
板において、前記パツド内または、前記パツドを
一部分とする位置に導通孔を設けたことを特徴と
する印刷配線板。
1. A printed wiring board having a pad for connecting surface-mounted components, characterized in that a conductive hole is provided within the pad or at a position where the pad is a part.
JP3914185U 1985-03-19 1985-03-19 Pending JPS61156268U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3914185U JPS61156268U (en) 1985-03-19 1985-03-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3914185U JPS61156268U (en) 1985-03-19 1985-03-19

Publications (1)

Publication Number Publication Date
JPS61156268U true JPS61156268U (en) 1986-09-27

Family

ID=30546814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3914185U Pending JPS61156268U (en) 1985-03-19 1985-03-19

Country Status (1)

Country Link
JP (1) JPS61156268U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0414286A (en) * 1990-05-07 1992-01-20 Ibiden Co Ltd Printed wiring board for surface mounting

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5328867B2 (en) * 1971-12-29 1978-08-17
JPS61107791A (en) * 1984-10-31 1986-05-26 株式会社東芝 Printed wiring board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5328867B2 (en) * 1971-12-29 1978-08-17
JPS61107791A (en) * 1984-10-31 1986-05-26 株式会社東芝 Printed wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0414286A (en) * 1990-05-07 1992-01-20 Ibiden Co Ltd Printed wiring board for surface mounting

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