JPH0410363U - - Google Patents
Info
- Publication number
- JPH0410363U JPH0410363U JP5151490U JP5151490U JPH0410363U JP H0410363 U JPH0410363 U JP H0410363U JP 5151490 U JP5151490 U JP 5151490U JP 5151490 U JP5151490 U JP 5151490U JP H0410363 U JPH0410363 U JP H0410363U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- electronic component
- solder
- wavy
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例によるリード端子
構造を有する電子部品の実装状態を示す斜視図、
第２図Ａ，Ｂは各々従来及びこの考案の一実施例
に係わるはんだ接合部の断面を示す説明図、第３
図Ａ，Ｂは各々この考案の一実施例によるリード
端子のブリツジ防止作用を説明する説明図、並び
に第４図は従来のリード端子構造を有する電子部
品の実装状態を示す斜視図である。
図において、１は電子部品、２はリード端子、
３はプリント基板、４は電極、５ははんだ接合部
である。なお、図中、同一符号は同一、又は相当
部分を示す。
FIG. 1 is a perspective view showing a mounted state of an electronic component having a lead terminal structure according to an embodiment of the invention;
2A and 2B are explanatory diagrams showing cross sections of solder joints according to the conventional method and an embodiment of the present invention, respectively;
FIGS. A and B are explanatory diagrams each illustrating the bridging prevention effect of a lead terminal according to an embodiment of the invention, and FIG. 4 is a perspective view showing a mounting state of an electronic component having a conventional lead terminal structure. In the figure, 1 is an electronic component, 2 is a lead terminal,
3 is a printed circuit board, 4 is an electrode, and 5 is a solder joint. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
おいて、はんだ接続される部分のリード端子形状
を波状にしたことを特徴とする電子部品のリード
端子。 A lead terminal for an electronic component used for surface mounting, characterized in that the shape of the lead terminal at the part to be connected by solder is wavy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5151490U JPH0410363U (en) | 1990-05-16 | 1990-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5151490U JPH0410363U (en) | 1990-05-16 | 1990-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0410363U true JPH0410363U (en) | 1992-01-29 |
Family
ID=31571030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5151490U Pending JPH0410363U (en) | 1990-05-16 | 1990-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410363U (en) |
-
1990
- 1990-05-16 JP JP5151490U patent/JPH0410363U/ja active Pending