JPS6433774U - - Google Patents
Info
- Publication number
- JPS6433774U JPS6433774U JP12747787U JP12747787U JPS6433774U JP S6433774 U JPS6433774 U JP S6433774U JP 12747787 U JP12747787 U JP 12747787U JP 12747787 U JP12747787 U JP 12747787U JP S6433774 U JPS6433774 U JP S6433774U
- Authority
- JP
- Japan
- Prior art keywords
- circuit conductor
- circuit
- external lead
- defect
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 230000007547 defect Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す回路導体接続
方法の説明図、第２図は従来の電子部品の外部リ
ードと回路基板の接続導体の接続構成を示す斜視
図、第３図はその回路導体接続構成図、第４図は
本考案の第２実施例を示す回路接続導体構造を示
す断面図、第５図は本考案の第３実施例を示す回
路接続導体の構成図である。
１０……回路基板、１１，２１，３１……接続
導体、１２……スリツト、１３，２３……半田、
１４，２４，３７……外部リード、３２……窪み
、３５……素子搭載部、３６……内部リード。
Fig. 1 is an explanatory diagram of a circuit conductor connection method showing an embodiment of the present invention, Fig. 2 is a perspective view showing a connection configuration between the external lead of a conventional electronic component and a connection conductor of a circuit board, and Fig. 3 is the FIG. 4 is a sectional view showing a circuit connection conductor structure according to a second embodiment of the present invention, and FIG. 5 is a configuration diagram of a circuit connection conductor according to a third embodiment of the present invention. 10... Circuit board, 11, 21, 31... Connection conductor, 12... Slit, 13, 23... Solder,
14, 24, 37...external lead, 32...recess, 35...element mounting portion, 36...internal lead.
Claims (1)
るための前記回路基板に形成される回路導体に欠
所を設け、前記外部リードと回路導体を位置合わ
せし、両者を接続するようにしたことを特徴とす
る回路導体接続構造。 (2) 前記欠所はスリツト若しくは窪みであるこ
とを特徴とする実用新案登録請求の範囲第１項記
載の回路導体接続構造。[Claims for Utility Model Registration] (1) Provide a defect in a circuit conductor formed on the circuit board for connecting a circuit board and an external lead of an electronic component, and align the external lead and the circuit conductor; A circuit conductor connection structure characterized by connecting both. (2) The circuit conductor connection structure according to claim 1, wherein the defect is a slit or a depression.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12747787U JPS6433774U (en) | 1987-08-24 | 1987-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12747787U JPS6433774U (en) | 1987-08-24 | 1987-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6433774U true JPS6433774U (en) | 1989-03-02 |
Family
ID=31379947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12747787U Pending JPS6433774U (en) | 1987-08-24 | 1987-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6433774U (en) |
-
1987
- 1987-08-24 JP JP12747787U patent/JPS6433774U/ja active Pending
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