JPS5848098U - magnetic bubble memory package - Google Patents

magnetic bubble memory package

Info

Publication number
JPS5848098U
JPS5848098U JP14091281U JP14091281U JPS5848098U JP S5848098 U JPS5848098 U JP S5848098U JP 14091281 U JP14091281 U JP 14091281U JP 14091281 U JP14091281 U JP 14091281U JP S5848098 U JPS5848098 U JP S5848098U
Authority
JP
Japan
Prior art keywords
magnetic bubble
bubble memory
memory package
welded
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14091281U
Other languages
Japanese (ja)
Inventor
助田　俊明
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP14091281U priority Critical patent/JPS5848098U/en
Publication of JPS5848098U publication Critical patent/JPS5848098U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は磁気バブルメモリチップ塔載用基板の正面図、
第２図は基板を装着する樹脂パッケージ、　　の斜視図
、第３図は光来のパッケージの断面図、第４図は本考案
にかさるパッケージの断面図、第５図は基板と本考案の
リードフレームとの貫入状態を示す図、第６図はこの部
分拡大図である。 図において、１は基板、２は磁気バブルメモリ　　゛、
　　チップ、５は基板端子、８はリードフレーム、１１
は突起、１２はスルーホール、１３は９０６−の屈折部
。Figure 1 is a front view of the magnetic bubble memory chip mounting board.
Fig. 2 is a perspective view of a resin package to which a board is mounted, Fig. 3 is a sectional view of Korai's package, Fig. 4 is a sectional view of a package according to the present invention, and Fig. 5 is a perspective view of a resin package to which a substrate is attached. FIG. 6 is a partially enlarged view showing the state of penetration into the lead frame. In the figure, 1 is a substrate, 2 is a magnetic bubble memory.
Chip, 5 is board terminal, 8 is lead frame, 11
12 is a protrusion, 12 is a through hole, and 13 is a bent portion of 906-.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 扁平角状をなす樹脂ケースの両側面にリードフレームが
インサートモールドされてデュアルインライン構成をと
り、該リードフレームがケース内部に装着されている磁
気バブルメモリチップ搭載用印刷配線基板の電極端子部
と溶着される構造をとる磁気バブルメモリパッケージに
おいて、該リードフレームがケース内部においてはＳ゛
９０°Ｃ９０°Ｃ上方おり、該屈折部より少くとも１１
ｒａｎの距離を隔て＼該す−ドフレームの先端部が前記
印刷配線基板のスルーホール端子に貫入溶着される構成
をとることを特徴とする磁気バブルメモリパッケージ。A lead frame is insert-molded on both sides of a flat square resin case to form a dual-in-line configuration, and the lead frame is welded to the electrode terminals of a printed wiring board for mounting a magnetic bubble memory chip mounted inside the case. In a magnetic bubble memory package having a structure of
1. A magnetic bubble memory package characterized in that a leading end of a corresponding frame is penetrated and welded to a through-hole terminal of the printed wiring board at a distance of 100 nm.
JP14091281U 1981-09-22 1981-09-22 magnetic bubble memory package Pending JPS5848098U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14091281U JPS5848098U (en) 1981-09-22 1981-09-22 magnetic bubble memory package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14091281U JPS5848098U (en) 1981-09-22 1981-09-22 magnetic bubble memory package

Publications (1)

Publication Number Publication Date
JPS5848098U true JPS5848098U (en) 1983-03-31

Family

ID=29934046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14091281U Pending JPS5848098U (en) 1981-09-22 1981-09-22 magnetic bubble memory package

Country Status (1)

Country Link
JP (1) JPS5848098U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08142028A (en) * 1994-11-25 1996-06-04 Nippon Kokan Light Steel Kk Segment form

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08142028A (en) * 1994-11-25 1996-06-04 Nippon Kokan Light Steel Kk Segment form

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