JPS6226923U - - Google Patents
Info
- Publication number
- JPS6226923U JPS6226923U JP11758285U JP11758285U JPS6226923U JP S6226923 U JPS6226923 U JP S6226923U JP 11758285 U JP11758285 U JP 11758285U JP 11758285 U JP11758285 U JP 11758285U JP S6226923 U JPS6226923 U JP S6226923U
- Authority
- JP
- Japan
- Prior art keywords
- circuit element
- lead terminal
- base
- electronic component
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 2
- 239000011162 core material Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図は本考案の実施例を示す図、第２図は第
１図の要部を示す図、第３図は比較データを示す
図である。
１……ベース本体、２１，３２，３３，３４…
…リード端子、４……導電性接着剤（ドータイト
）、６……プリント配線基板。
FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a diagram showing the main part of FIG. 1, and FIG. 3 is a diagram showing comparative data. 1... Base body, 21, 32, 33, 34...
... Lead terminal, 4 ... Conductive adhesive (Dotite), 6 ... Printed wiring board.
Claims (1)
子を貫通封着するベースと、そのベースに設置さ
れる少なくとも１つ以上の回路素子、もしくは前
記回路素子と回路素子より延出するリード線とを
具備する電子部品であつて、前記リード端子は芯
材の周囲に銀メツキ処理が施され、このリード端
子と回路素子、またはリード端子と回路素子より
延出するリード線は導電性接着剤にて接続されて
いることを特徴とする電子部品。 A base having a lead terminal penetrated and sealed with an insulating material at a predetermined position of the base body, at least one circuit element installed on the base, or the circuit element and a lead wire extending from the circuit element. In the electronic component, the lead terminal is silver-plated around the core material, and the lead terminal and the circuit element, or the lead wire extending from the lead terminal and the circuit element, are coated with a conductive adhesive. An electronic component characterized by being connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11758285U JPS6226923U (en) | 1985-07-30 | 1985-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11758285U JPS6226923U (en) | 1985-07-30 | 1985-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6226923U true JPS6226923U (en) | 1987-02-18 |
Family
ID=31003233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11758285U Pending JPS6226923U (en) | 1985-07-30 | 1985-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6226923U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0355661U (en) * | 1989-06-02 | 1991-05-29 |
-
1985
- 1985-07-30 JP JP11758285U patent/JPS6226923U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0355661U (en) * | 1989-06-02 | 1991-05-29 |
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