JPS62101223U - - Google Patents
Info
- Publication number
- JPS62101223U JPS62101223U JP19174185U JP19174185U JPS62101223U JP S62101223 U JPS62101223 U JP S62101223U JP 19174185 U JP19174185 U JP 19174185U JP 19174185 U JP19174185 U JP 19174185U JP S62101223 U JPS62101223 U JP S62101223U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit board
- printed circuit
- resin coating
- composite electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第1図は本考案の実施例の側面断面図、第2図
は従来の複合電子部品を配線板に接続した状態の
断面図を示す。
1…プリント基板、2…電子部品、3…樹脂被
覆、4…リード端子、5…フレキシブルプリント
基板、8…複合電子部品。
FIG. 1 is a side sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional composite electronic component connected to a wiring board. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2... Electronic component, 3... Resin coating, 4... Lead terminal, 5... Flexible printed circuit board, 8... Composite electronic component.
Claims (1)
を前記プリント基板とともに樹脂被覆し該樹脂被
覆から端子を引き出した複合電子部品において、
プリント基板に電気的に接続され樹脂被覆から導
出されたフレキシブルプリント基板を有すること
を特徴とする複合電子部品。 A composite electronic component in which an electronic component is connected to a printed circuit board, the electronic component is coated with a resin together with the printed circuit board, and a terminal is drawn out from the resin coating,
A composite electronic component characterized by having a flexible printed circuit board electrically connected to a printed circuit board and derived from a resin coating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19174185U JPH0351953Y2 (en) | 1985-12-13 | 1985-12-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19174185U JPH0351953Y2 (en) | 1985-12-13 | 1985-12-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62101223U true JPS62101223U (en) | 1987-06-27 |
JPH0351953Y2 JPH0351953Y2 (en) | 1991-11-08 |
Family
ID=31146165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19174185U Expired JPH0351953Y2 (en) | 1985-12-13 | 1985-12-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0351953Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180037283A (en) * | 2015-09-28 | 2018-04-11 | 택토텍 오와이 | METHOD FOR MANUFACTURING STRUCTURES & |
-
1985
- 1985-12-13 JP JP19174185U patent/JPH0351953Y2/ja not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180037283A (en) * | 2015-09-28 | 2018-04-11 | 택토텍 오와이 | METHOD FOR MANUFACTURING STRUCTURES & |
JP2018532617A (en) * | 2015-09-28 | 2018-11-08 | タクトテク オーユー | Multilayer structure for electronic equipment and related manufacturing methods |
JP2019169722A (en) * | 2015-09-28 | 2019-10-03 | タクトテク オーユー | Multilayer structure for electronic apparatus and related manufacturing methods |
Also Published As
Publication number | Publication date |
---|---|
JPH0351953Y2 (en) | 1991-11-08 |
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