JPS62101223U - - Google Patents

Info

Publication number
JPS62101223U
JPS62101223U JP19174185U JP19174185U JPS62101223U JP S62101223 U JPS62101223 U JP S62101223U JP 19174185 U JP19174185 U JP 19174185U JP 19174185 U JP19174185 U JP 19174185U JP S62101223 U JPS62101223 U JP S62101223U
Authority
JP
Japan
Prior art keywords
electronic component
circuit board
printed circuit
resin coating
composite electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19174185U
Other languages
Japanese (ja)
Other versions
JPH0351953Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19174185U priority Critical patent/JPH0351953Y2/ja
Publication of JPS62101223U publication Critical patent/JPS62101223U/ja
Application granted granted Critical
Publication of JPH0351953Y2 publication Critical patent/JPH0351953Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例の側面断面図、第2図
は従来の複合電子部品を配線板に接続した状態の
断面図を示す。 1…プリント基板、2…電子部品、3…樹脂被
覆、4…リード端子、5…フレキシブルプリント
基板、8…複合電子部品。
FIG. 1 is a side sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional composite electronic component connected to a wiring board. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2... Electronic component, 3... Resin coating, 4... Lead terminal, 5... Flexible printed circuit board, 8... Composite electronic component.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板に電子部品を接続し、該電子部品
を前記プリント基板とともに樹脂被覆し該樹脂被
覆から端子を引き出した複合電子部品において、
プリント基板に電気的に接続され樹脂被覆から導
出されたフレキシブルプリント基板を有すること
を特徴とする複合電子部品。
A composite electronic component in which an electronic component is connected to a printed circuit board, the electronic component is coated with a resin together with the printed circuit board, and a terminal is drawn out from the resin coating,
A composite electronic component characterized by having a flexible printed circuit board electrically connected to a printed circuit board and derived from a resin coating.
JP19174185U 1985-12-13 1985-12-13 Expired JPH0351953Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19174185U JPH0351953Y2 (en) 1985-12-13 1985-12-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19174185U JPH0351953Y2 (en) 1985-12-13 1985-12-13

Publications (2)

Publication Number Publication Date
JPS62101223U true JPS62101223U (en) 1987-06-27
JPH0351953Y2 JPH0351953Y2 (en) 1991-11-08

Family

ID=31146165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19174185U Expired JPH0351953Y2 (en) 1985-12-13 1985-12-13

Country Status (1)

Country Link
JP (1) JPH0351953Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180037283A (en) * 2015-09-28 2018-04-11 택토텍 오와이 METHOD FOR MANUFACTURING STRUCTURES &

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180037283A (en) * 2015-09-28 2018-04-11 택토텍 오와이 METHOD FOR MANUFACTURING STRUCTURES &
JP2018532617A (en) * 2015-09-28 2018-11-08 タクトテク オーユー Multilayer structure for electronic equipment and related manufacturing methods
JP2019169722A (en) * 2015-09-28 2019-10-03 タクトテク オーユー Multilayer structure for electronic apparatus and related manufacturing methods

Also Published As

Publication number Publication date
JPH0351953Y2 (en) 1991-11-08

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