JPH02106867U - - Google Patents
Info
- Publication number
- JPH02106867U JPH02106867U JP1612689U JP1612689U JPH02106867U JP H02106867 U JPH02106867 U JP H02106867U JP 1612689 U JP1612689 U JP 1612689U JP 1612689 U JP1612689 U JP 1612689U JP H02106867 U JPH02106867 U JP H02106867U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- protective tape
- printed circuit
- soldering
- resin coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案の平面図、第２図は同じく側面
縦断面図である。
１……プリント配線基板、２……ＩＣ、３……
端子、４……保護テープ、５……樹脂コーテイン
グ。
FIG. 1 is a plan view of the present invention, and FIG. 2 is a side longitudinal sectional view. 1...Printed wiring board, 2...IC, 3...
Terminal, 4... Protective tape, 5... Resin coating.
Claims (1)
Ｃ等の電気部品をハンダ付け装着すると共に、少
なくとも上記ＩＣの端子を含む表面を保護テープ
にて被覆し、かつこの保護テープの表面を含む上
記プリント基板上に、絶縁用の樹脂コーテイング
を施して成るプリント配線基板。 Flat package type I on the surface of the printed circuit board
At the same time as soldering and mounting electrical components such as C, at least the surface including the terminals of the IC is covered with a protective tape, and an insulating resin coating is applied to the printed circuit board including the surface of the protective tape. A printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1612689U JPH02106867U (en) | 1989-02-13 | 1989-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1612689U JPH02106867U (en) | 1989-02-13 | 1989-02-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106867U true JPH02106867U (en) | 1990-08-24 |
Family
ID=31228784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1612689U Pending JPH02106867U (en) | 1989-02-13 | 1989-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106867U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4834356A (en) * | 1971-09-07 | 1973-05-18 | ||
| JPS49116973A (en) * | 1973-03-10 | 1974-11-08 |
-
1989
- 1989-02-13 JP JP1612689U patent/JPH02106867U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4834356A (en) * | 1971-09-07 | 1973-05-18 | ||
| JPS49116973A (en) * | 1973-03-10 | 1974-11-08 |