JPH0193757U - - Google Patents
Info
- Publication number
- JPH0193757U JPH0193757U JP18989287U JP18989287U JPH0193757U JP H0193757 U JPH0193757 U JP H0193757U JP 18989287 U JP18989287 U JP 18989287U JP 18989287 U JP18989287 U JP 18989287U JP H0193757 U JPH0193757 U JP H0193757U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- metal layer
- printed wiring
- wiring metal
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案に係るプリント配線基板の一例
を示す図、第２図ないし第５図は本考案に係るプ
リント配線基板を用いた電子回路装置を製造する
過程を示す図、第６図ないし第８図は従来のプリ
ント配線基板を用いた電子回路装置の製造過程を
示す図、第９図は樹脂パツケージを施した電子回
路装置の外観を示す斜視図である。
２１…実装部品、２２…プリント配線基板、２
３…金属ベース、２４…絶縁層、２５…配線金属
層、２７…外部リード端子、３１…電子回路装置
、３５…金属層。
FIG. 1 is a diagram showing an example of a printed wiring board according to the present invention, FIGS. 2 to 5 are diagrams showing a process of manufacturing an electronic circuit device using the printed wiring board according to the present invention, and FIGS. FIG. 8 is a diagram showing the manufacturing process of an electronic circuit device using a conventional printed wiring board, and FIG. 9 is a perspective view showing the appearance of the electronic circuit device with a resin package. 21... Mounted component, 22... Printed wiring board, 2
3... Metal base, 24... Insulating layer, 25... Wiring metal layer, 27... External lead terminal, 31... Electronic circuit device, 35... Metal layer.
Claims (1)
たプリント配線基板において、前記配線金属層を
プリント配線基板の領域外まで延設して外部リー
ド端子としたことを特徴とするプリント配線基板
。 1. A printed wiring board comprising a wiring metal layer with a predetermined pattern on the surface of an insulator, wherein the wiring metal layer is extended outside the area of the printed wiring board to serve as an external lead terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18989287U JPH0193757U (en) | 1987-12-16 | 1987-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18989287U JPH0193757U (en) | 1987-12-16 | 1987-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0193757U true JPH0193757U (en) | 1989-06-20 |
Family
ID=31480900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18989287U Pending JPH0193757U (en) | 1987-12-16 | 1987-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193757U (en) |
-
1987
- 1987-12-16 JP JP18989287U patent/JPH0193757U/ja active Pending