JPH0221774U - - Google Patents
Info
- Publication number
- JPH0221774U JPH0221774U JP10049388U JP10049388U JPH0221774U JP H0221774 U JPH0221774 U JP H0221774U JP 10049388 U JP10049388 U JP 10049388U JP 10049388 U JP10049388 U JP 10049388U JP H0221774 U JPH0221774 U JP H0221774U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- wiring pattern
- circuit
- board device
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Description
第１図は本発明の一実施例になる回路基板装置
の一部平面図、第２図は第１図の変形例になる回
路基板装置の一部平面図、第３図は一般的な回路
基板装置の一部平面図、第４図は従来の回路基板
装置の平面図を夫々示す。
６…ＩＣ、７…端子、１０，１３…配線パター
ン、１１，１２…配線パターン露出部、１４ａ〜
１４ｆ…露出部。
FIG. 1 is a partial plan view of a circuit board device according to an embodiment of the present invention, FIG. 2 is a partial plan view of a circuit board device that is a modification of FIG. 1, and FIG. 3 is a general circuit. FIG. 4 shows a partial plan view of the board device, and FIG. 4 shows a plan view of a conventional circuit board device. 6... IC, 7... Terminal, 10, 13... Wiring pattern, 11, 12... Wiring pattern exposed portion, 14a~
14f...Exposed part.
Claims (1)
子が半田接続される部分以外の配線パターン面上
に絶縁被膜が形成される様にされた回路基板装置
において、 該電気回路部品の内、端子ピツチの小さな回路
部品の端子が接続される配線パターンの一部に該
絶縁被膜で覆われない露出部を形成する様する様
にした事を特徴とする回路基板装置。[Scope of Claim for Utility Model Registration] A circuit board device in which an insulating film is formed on the surface of the wiring pattern of the circuit board other than the portion where the terminals of the electrical circuit components are soldered. A circuit board device characterized in that an exposed portion not covered with the insulating film is formed in a part of a wiring pattern to which a terminal of a circuit component having a small terminal pitch among the circuit components is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10049388U JPH0221774U (en) | 1988-07-29 | 1988-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10049388U JPH0221774U (en) | 1988-07-29 | 1988-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221774U true JPH0221774U (en) | 1990-02-14 |
Family
ID=31328615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10049388U Pending JPH0221774U (en) | 1988-07-29 | 1988-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221774U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6362294A (en) * | 1986-09-02 | 1988-03-18 | 三菱電機株式会社 | Printed wiring board |
-
1988
- 1988-07-29 JP JP10049388U patent/JPH0221774U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6362294A (en) * | 1986-09-02 | 1988-03-18 | 三菱電機株式会社 | Printed wiring board |
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