JPS6337082U - - Google Patents
Info
- Publication number
- JPS6337082U JPS6337082U JP1986131931U JP13193186U JPS6337082U JP S6337082 U JPS6337082 U JP S6337082U JP 1986131931 U JP1986131931 U JP 1986131931U JP 13193186 U JP13193186 U JP 13193186U JP S6337082 U JPS6337082 U JP S6337082U
- Authority
- JP
- Japan
- Prior art keywords
- connection
- insulating substrate
- wiring pattern
- utility
- electronic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図ａ，ｂは本考案による一実施例の斜視図
、第２図は本考案による他の一実施例の斜視図、
第３図は本実施例を実装接続した状態を示す平面
図、第４図は従来技術による斜視図である。
図において、１は絶縁性基板、１ａは接続用パ
ターン、１ｂは接続部、１ｂ―１はランド、１ｂ
―２はリード端子（フラツトタイプ）、１ｂ―３
はリード端子（ピンタイプ）、２は回路基板、２
ａは配線パターン、３はＩＣパツケージ、１０，
１１，１２は接続装置、を示す。
Figures 1a and b are perspective views of one embodiment of the present invention; Figure 2 is a perspective view of another embodiment of the present invention;
FIG. 3 is a plan view showing the state in which this embodiment is mounted and connected, and FIG. 4 is a perspective view of the conventional technology. In the figure, 1 is an insulating substrate, 1a is a connection pattern, 1b is a connection part, 1b-1 is a land, 1b
-2 is lead terminal (flat type), 1b-3
is a lead terminal (pin type), 2 is a circuit board, 2
a is the wiring pattern, 3 is the IC package, 10,
11 and 12 indicate connection devices.
Claims (1)
続用導体配線パターン１ａを絶縁性基板１に形成
してなることを特徴とする電子回路接続装置。 An electronic circuit connection device characterized in that at least one connection conductor wiring pattern 1a having connection portions 1b at both ends is formed on an insulating substrate 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986131931U JPS6337082U (en) | 1986-08-27 | 1986-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986131931U JPS6337082U (en) | 1986-08-27 | 1986-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6337082U true JPS6337082U (en) | 1988-03-10 |
Family
ID=31030843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986131931U Pending JPS6337082U (en) | 1986-08-27 | 1986-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6337082U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021084601A1 (en) * | 2019-10-29 | 2021-05-06 | 日本電信電話株式会社 | High-frequency line connection structure |
-
1986
- 1986-08-27 JP JP1986131931U patent/JPS6337082U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021084601A1 (en) * | 2019-10-29 | 2021-05-06 | 日本電信電話株式会社 | High-frequency line connection structure |
| JPWO2021084601A1 (en) * | 2019-10-29 | 2021-05-06 | ||
| CN114631226A (en) * | 2019-10-29 | 2022-06-14 | 日本电信电话株式会社 | High-frequency line connection structure |
| CN114631226B (en) * | 2019-10-29 | 2024-01-16 | 日本电信电话株式会社 | High-frequency circuit connection structure |
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