JPS6212983U - - Google Patents

Info

Publication number
JPS6212983U
JPS6212983U JP10328385U JP10328385U JPS6212983U JP S6212983 U JPS6212983 U JP S6212983U JP 10328385 U JP10328385 U JP 10328385U JP 10328385 U JP10328385 U JP 10328385U JP S6212983 U JPS6212983 U JP S6212983U
Authority
JP
Japan
Prior art keywords
conductor
insulating film
substrate
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10328385U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10328385U priority Critical patent/JPS6212983U/ja
Publication of JPS6212983U publication Critical patent/JPS6212983U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａは本考案の一実施例の平面図、第１図
ｂは第１図のＡ―Ａ断面図、第１図ｃは第１図ｂ
に示す実施例に部品端子を乗せて半田付を施した
状態を示す断面図、第２図ａは従来の印刷回路基
板の平面図、第２図ｂおよびｃは第２図ａに示す
従来例に部品端子を乗せ半田付を施した状態を示
す断面図である。 １１……基板、１２……第１のパツド（導体）
、１３……絶縁皮膜、１４……第２のパツド（導
体）、１５……孔、１６……電子部品、１７……
端子、１８……半田。 Figure 1a is a plan view of an embodiment of the present invention, Figure 1b is a sectional view taken along line AA in Figure 1, and Figure 1c is Figure 1b.
FIG. 2a is a plan view of a conventional printed circuit board, and FIGS. 2b and c are the conventional example shown in FIG. 2a. FIG. 3 is a sectional view showing a state in which component terminals are mounted and soldered. 11... Board, 12... First pad (conductor)
, 13... Insulating film, 14... Second pad (conductor), 15... Hole, 16... Electronic component, 17...
Terminal, 18...Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板と、該基板上に設けた第１の導体と、該第
１の導体上に設けた絶縁皮膜と、該絶縁皮膜上に
設けた第２の導体と、前記第２の導体と前記絶縁
皮膜とを貫通する少なくとも１つの孔とを有する
ことを特徴とする印刷回路基板。 a substrate, a first conductor provided on the substrate, an insulating film provided on the first conductor, a second conductor provided on the insulating film, the second conductor and the insulating film and at least one hole passing through the printed circuit board.
JP10328385U 1985-07-05 1985-07-05 Pending JPS6212983U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10328385U JPS6212983U (en) 1985-07-05 1985-07-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10328385U JPS6212983U (en) 1985-07-05 1985-07-05

Publications (1)

Publication Number Publication Date
JPS6212983U true JPS6212983U (en) 1987-01-26

Family

ID=30975694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10328385U Pending JPS6212983U (en) 1985-07-05 1985-07-05

Country Status (1)

Country Link
JP (1) JPS6212983U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59232494A (en) * 1983-06-15 1984-12-27 松下電工株式会社 Method of producing multilayer printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59232494A (en) * 1983-06-15 1984-12-27 松下電工株式会社 Method of producing multilayer printed circuit board

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