JPS6346873U - - Google Patents
Info
- Publication number
- JPS6346873U JPS6346873U JP1986140033U JP14003386U JPS6346873U JP S6346873 U JPS6346873 U JP S6346873U JP 1986140033 U JP1986140033 U JP 1986140033U JP 14003386 U JP14003386 U JP 14003386U JP S6346873 U JPS6346873 U JP S6346873U
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- multilayer thin
- film substrate
- mounting device
- substrate mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図はこの考案の一実施例に係る多層薄膜基
板取付け装置を示す構成説明図、第２図は第１図
の多層薄膜基板のうち２枚を取出して示す斜視図
、第３図は第１図の接続端子を取出して示す断面
図、第４図は従来の多層薄膜基板取付け装置を示
す構成説明図、第５図は第４図の取付け状態を説
明するために示した斜視図である。
１０……筐体、１１……多層薄膜基板、１２…
…電子回路、１３……第１の接続端子、１３ａ…
…ピン部、１３ｂ……ソケツト部、１４……導体
、１５……突起部、１６……凹部。
FIG. 1 is a configuration explanatory diagram showing a multilayer thin film substrate mounting device according to an embodiment of the invention, FIG. 2 is a perspective view showing two of the multilayer thin film substrates shown in FIG. 1, and FIG. 1 is a sectional view showing the connecting terminal taken out, FIG. 4 is a configuration explanatory diagram showing a conventional multilayer thin film board mounting device, and FIG. 5 is a perspective view shown to explain the mounting state of FIG. 4. . 10... Housing, 11... Multilayer thin film substrate, 12...
...electronic circuit, 13 ...first connection terminal, 13a...
...Pin portion, 13b...Socket portion, 14...Conductor, 15...Protrusion, 16...Recess.
Claims (1)
接してなる多層薄膜基板取付け装置において、前
記多層薄膜基板の各連接面に各電子回路に電気的
に接続された接続端子を設け、この接続端子を係
合して連接することを特徴とする多層薄膜基板取
付け装置。 In a multilayer thin film substrate mounting device formed by connecting a plurality of multilayer thin film substrates on which electronic circuits are formed, a connecting terminal electrically connected to each electronic circuit is provided on each connecting surface of the multilayer thin film substrate, and the connecting terminal A multilayer thin film substrate mounting device characterized by engaging and connecting the multilayer thin film substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986140033U JPS6346873U (en) | 1986-09-12 | 1986-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986140033U JPS6346873U (en) | 1986-09-12 | 1986-09-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6346873U true JPS6346873U (en) | 1988-03-30 |
Family
ID=31046497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986140033U Pending JPS6346873U (en) | 1986-09-12 | 1986-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6346873U (en) |
-
1986
- 1986-09-12 JP JP1986140033U patent/JPS6346873U/ja active Pending
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