JPS5974758U - Wiring board structure - Google Patents
Wiring board structureInfo
- Publication number
- JPS5974758U JPS5974758U JP17130282U JP17130282U JPS5974758U JP S5974758 U JPS5974758 U JP S5974758U JP 17130282 U JP17130282 U JP 17130282U JP 17130282 U JP17130282 U JP 17130282U JP S5974758 U JPS5974758 U JP S5974758U
- Authority
- JP
- Japan
- Prior art keywords
- lines
- ground
- insulating substrate
- wiring board
- board structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の１実施例の部分平面図、第２図及び第
３図は第１図の■一■及び■−■各断面断面図る。
主な図番の説明、１，２・・・第１、第２絶縁基板、４
・・・信号ライン、５，５・・・１組のアースライン、
６、７・・・第１、第２アースパターン、９・・・導体
箔。FIG. 1 is a partial plan view of one embodiment of the present invention, and FIGS. 2 and 3 are cross-sectional views of FIG. Explanation of main drawing numbers, 1, 2...first and second insulating substrates, 4
...Signal line, 5,5...1 set of ground lines,
6, 7...first and second ground patterns, 9...conductor foil.
Claims (2)
の両側に離間して配備された１組のアースラインとを設
け、該絶縁基板の他面に前記３本のラインの投影線をカ
バーする第１アースパターンを設け、前記絶縁基板上の
前記３本のラインの上側に配備された第２絶縁基板の表
面に前記３本のラインの投影線をカバーする第２アース
パターンを設け、さらに前記両絶縁基板の前記アースラ
インに対応する適所に複数の貫通孔を穿けその孔内に前
記アースライン及び前記両アースパターンを相互に電気
的に接続する導体箔を設けてなる配線基板構造。(1) A signal line and a pair of ground lines spaced apart on both sides of the signal line are provided on one surface of the insulating substrate, and the projection lines of the three lines are covered on the other surface of the insulating substrate. a first ground pattern is provided, a second ground pattern covering the projection lines of the three lines is provided on the surface of a second insulating substrate disposed above the three lines on the insulating substrate; A wiring board structure in which a plurality of through holes are bored at appropriate positions corresponding to the ground lines of both insulating substrates, and a conductive foil is provided in the holes to electrically connect the ground lines and both ground patterns to each other.
成形されていることを特徴とする請求の範囲第（１）項
記載の配線基板構造。(2) The wiring board structure according to claim (1), wherein both of the insulating boards are molded from a flexible shaft resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17130282U JPS5974758U (en) | 1982-11-11 | 1982-11-11 | Wiring board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17130282U JPS5974758U (en) | 1982-11-11 | 1982-11-11 | Wiring board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5974758U true JPS5974758U (en) | 1984-05-21 |
Family
ID=30373720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17130282U Pending JPS5974758U (en) | 1982-11-11 | 1982-11-11 | Wiring board structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5974758U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62259500A (en) * | 1986-05-02 | 1987-11-11 | 株式会社東芝 | Circuit board |
| JPS63261859A (en) * | 1987-04-20 | 1988-10-28 | Shinko Electric Ind Co Ltd | Package for high-frequency elements |
| JP6330977B2 (en) * | 2016-01-27 | 2018-05-30 | 株式会社村田製作所 | Signal transmission line |
-
1982
- 1982-11-11 JP JP17130282U patent/JPS5974758U/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62259500A (en) * | 1986-05-02 | 1987-11-11 | 株式会社東芝 | Circuit board |
| JPS63261859A (en) * | 1987-04-20 | 1988-10-28 | Shinko Electric Ind Co Ltd | Package for high-frequency elements |
| JP6330977B2 (en) * | 2016-01-27 | 2018-05-30 | 株式会社村田製作所 | Signal transmission line |
| JP2018121076A (en) * | 2016-01-27 | 2018-08-02 | 株式会社村田製作所 | Signal transmission line |
| US10673114B2 (en) | 2016-01-27 | 2020-06-02 | Murata Manufacturing Co., Ltd. | Signal transmission line including a signal conductor and reinforcing conductor portions parallel to the signal conductor |
| JP2020141406A (en) * | 2016-01-27 | 2020-09-03 | 株式会社村田製作所 | Electronic apparatus |
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