JPS5944075U - multilayer printed wiring board - Google Patents
multilayer printed wiring boardInfo
- Publication number
- JPS5944075U JPS5944075U JP13951582U JP13951582U JPS5944075U JP S5944075 U JPS5944075 U JP S5944075U JP 13951582 U JP13951582 U JP 13951582U JP 13951582 U JP13951582 U JP 13951582U JP S5944075 U JPS5944075 U JP S5944075U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- multilayer printed
- signal pattern
- dummy land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の多層印刷配線板の投視図であり、第２図
、第３図はそれぞれ第１図の内層信号パターン層の平面
図、第４図ａ ” ｃは本考案による内層絶縁板の内層
信号パターン層の平面図である。
１・・・・・・表裏の信号パターン、２，２′・・・・
・・貫通スルホール、３・・・・・・内層信号パターン
、４・・・・・・回路の突起、５・・・・・・ダミーラ
ンド。FIG. 1 is a perspective view of a conventional multilayer printed wiring board, FIGS. 2 and 3 are plan views of the inner layer signal pattern layer of FIG. 1, and FIGS. 4a and 4c are inner layer insulation according to the present invention. It is a plan view of the inner layer signal pattern layer of the board. 1...Signal patterns on the front and back sides, 2, 2'...
...Through hole, 3...Inner layer signal pattern, 4...Protrusion of circuit, 5...Dummy land.
Claims (4)
線板において前記信号パターン層を選択的にエツチング
して設けた信号パターンに非接続でかつ上下の絶縁板と
貫通接続するスルホールを設ける位置にダミーランドを
設けたことを特徴とする多層印刷配線板。(1) In a multilayer printed wiring board having a signal pattern layer on an inner insulating board, the signal pattern layer is selectively etched to provide a through hole that is not connected to the signal pattern and that connects through the upper and lower insulating boards. A multilayer printed wiring board characterized by having a dummy land.
とする実用新案登録請求の範囲第１項記載の多層印刷配
線板。(2) The multilayer printed wiring board according to claim 1, wherein the dummy land has a circular shape.
とを特徴とする実用新案登録請求の範囲第１項記載の多
層印刷配線板。(3) The multilayer printed wiring board according to claim 1, wherein the dummy land has a ring shape.
円形ランドであることを特徴とする実用新案登録請求の
範囲第１項記載の多層印刷配線板。(4) The multilayer printed wiring board according to claim 1, wherein the shape of the dummy land is a circular land provided with a selectively removed portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13951582U JPS5944075U (en) | 1982-09-14 | 1982-09-14 | multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13951582U JPS5944075U (en) | 1982-09-14 | 1982-09-14 | multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5944075U true JPS5944075U (en) | 1984-03-23 |
Family
ID=30312675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13951582U Pending JPS5944075U (en) | 1982-09-14 | 1982-09-14 | multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5944075U (en) |
-
1982
- 1982-09-14 JP JP13951582U patent/JPS5944075U/en active Pending
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