JPS59180460U

JPS59180460U - circuit board equipment

Info

Publication number: JPS59180460U
Application number: JP7522783U
Authority: JP
Inventors: 牛窪　隆夫; 猛松田
Original assignee: サンケン電気株式会社
Priority date: 1983-05-19
Filing date: 1983-05-19
Publication date: 1984-12-01
Also published as: JPH0223003Y2

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は本考案の実施例に係わる回路基板ブロックを示
す平面図、第２図は第１図の回路基板ブロックに対して
従来の方法で配線導体及び厚膜抵抗を形成したものを示
す一部拡大平面図、第３図は本考案の実施例に従って第
１図の基板ブロックに配線導体及び厚膜抵抗を形成した
状態を示す一部拡大平面図、第４図及び第５図は分割さ
れた後の単位基板及び回路を夫々示す平面図である。１・・・第１の単位基板、２・・・第２の単位基板、３
・・・回路基板ブロック、５・・・分割線、９・・・第
１の配線導体、１０・・・第２の配線導体、１１，１２
゜１３．１４・・・厚膜抵抗、１５・・・第１のトラン
ジスタ装着部分、１６・・・第２のトランジスタ装着部
分、１７・・・第１のトランジスタ、１８・・・第２の
トランジスタ。第２図１１第４図FIG. 1 is a plan view showing a circuit board block according to an embodiment of the present invention, and FIG. 2 is a plan view showing the circuit board block shown in FIG. 1 with wiring conductors and thick film resistors formed by a conventional method. FIG. 3 is a partially enlarged plan view showing a state in which wiring conductors and thick film resistors are formed on the substrate block of FIG. 1 according to an embodiment of the present invention; FIGS. FIG. 3 is a plan view showing the unit board and the circuit after the process is completed. DESCRIPTION OF SYMBOLS 1... First unit board, 2... Second unit board, 3
... Circuit board block, 5... Parting line, 9... First wiring conductor, 10... Second wiring conductor, 11, 12
゜13.14... Thick film resistor, 15... First transistor mounting part, 16... Second transistor mounting part, 17... First transistor, 18... Second transistor . Figure 2 11 Figure 4

Claims

[Scope of utility model registration request]

(1) To obtain a plurality of circuit devices that are substantially the same electrically and in shape, and formed so that at least first and second unit substrates having the same external shape are obtained by division, and the first a substrate block formed on the first unit substrate and having a polarity of 1;
a first wiring conductor formed to include a portion for mounting an electronic component having a structure, and a first wiring conductor formed on the second unit board and connecting the board block to the first and second unit boards; When divided and the orientations of the first and second unit boards are aligned in the same direction, the pattern is almost the same as that of the first wiring conductor except for the pattern of the part where the electronic component having the polarity is mounted. The pattern of the part to which the electronic component is mounted and has polarity is determined before dividing the board block so that the connection direction of the electronic component is the same as that of a second wiring conductor. A circuit board device comprising:

(2) The circuit device has a membrane resistor in addition to the electronic component having the polarity, and the membrane resistor is formed by dividing the substrate block into the first and second unit substrates. 2. The circuit board device according to claim 1, wherein the circuit board device is formed so that when the second unit boards are aligned in the same direction, the patterns are the same.

(3) The second orientation is an orientation obtained by rotating the first orientation by 180 degrees.
The circuit board device described in Section 1.

(4) The first and second unit substrates are approximately semicircular substrates as a whole.
3. The circuit board device according to item 3.