JPH0223003Y2 - - Google Patents

Description

[Detailed Description of the Invention] Technical Field The present invention relates to a circuit board device for obtaining a circuit device such as a hybrid IC that includes polarized electronic components such as transistors and diodes. The present invention relates to a circuit board device including a plurality of unit boards.

Prior Art As a means of mass-producing hybrid ICs (hybrid integrated circuits), a large board block that is a collection of unit boards is prepared, thick film resistors and thick film conductors are formed on multiple unit boards, and transistors, diodes,
Mount electronic components such as capacitors using automatic machines,
After that, there is a method of dividing it into individual substrates.

By the way, if a plurality of unit boards are arranged in the same direction, the direction of the circuit conductor pattern and the direction of the electronic components will necessarily be the same.
Easy to mount electronic components. However, in order to divide the substrate, make effective use of the substrate area, etc., the first unit substrate 1 having the first orientation as shown in FIG.
If a circuit board block 3 including a first unit board 2 and a second unit board 2 having a second orientation has to be used, mounting of polarized electronic components becomes troublesome. That is, in order to produce the same circuit device,
If wiring conductors 9, 10 and thick film resistors 11, 12, 13, 14 of the same pattern are formed on each unit board 1, 2, as is clear from FIG. The direction is reversed. Therefore, when mounting the transistors 17 and 18 using a computer-controlled automounter, the program becomes complicated. In addition, when attaching the transistors 17 and 18 manually,
Mistakes in the mounting direction are likely to occur.

Purpose of the invention Therefore, the purpose of the present invention is to provide a circuit board device that is easy to manufacture.

Structure of the Device The present invention to achieve the above object is to obtain a plurality of circuit devices that are substantially equal electrically and in shape, and by dividing at least first and second circuit devices having the same external shape. a substrate block formed to obtain a unit substrate, the first unit substrate having a first orientation, and the second unit substrate having a second orientation; A first wiring conductor is formed on a unit board and is formed to include a portion for mounting a polarized electronic component, and a first wiring conductor is formed on the second unit board and connects the board block to the first wiring conductor. And when the first and second unit boards are divided into a second unit board and aligned in the same direction, the first wiring conductor except for the pattern of the part where the electronic component having the polarity is mounted. The pattern of the portions on which the electronic components having polarity are mounted is formed to have substantially the same pattern and is determined before dividing the board block so that the direction of connection of the electronic components is the same. The present invention relates to a circuit board device characterized by comprising a second wiring conductor.

Effects of the invention According to the above invention, first and second wiring conductors having substantially the same pattern after division are provided on the first and second unit boards facing different directions within the board block, and the polarity is Since the patterns of the parts on which electronic components with polarity are mounted are made to be substantially the same on the first and second unit boards at the board block stage, when electronic components with polarity are mounted in the board block state, Furthermore, electronic components can be mounted on the first and second unit boards under substantially the same conditions. Therefore, manufacturing of the circuit device becomes easy. Furthermore, since the first and second wiring conductors have substantially the same configuration except for the portion where electronic components are mounted, they can be used as substantially the same circuit device. Furthermore, since the patterns of the first and second wiring conductors are substantially the same except for the electronic component mounting portion, the first and second wiring conductors are preferably arranged with respect to the first and second unit boards. It can be kept at

Embodiment Next, a circuit board device according to an embodiment of the present invention will be described with reference to FIGS. 1 and 3 to 5. The circuit board block 3 shown in FIG. 1 is an alumina ceramic board with a thickness of 0.6 mm, a long side of 6.1 cm, and a short side of 5.3 cm, and has a dividing line 5 provided on the main surface 4 of the board to obtain 12 circuit devices. consisting of a first unit substrate 1 and a second unit substrate arranged in a first direction (upward).
The second unit board 2 arranged in the direction (downward)
Further, five unit boards 1a to 1e arranged in the same direction as the first unit board 1, and five unit boards 2 arranged in the same direction as the second unit board 2.
Including a to 2e. Each unit board 1, 2, 1a-1
e, 2a to 2e are interconnected by a frame 6. Reference numeral 7 denotes a notch provided to form the unit substrates 1, 2, etc. into a predetermined shape and to facilitate division, and 8 is used when attaching the divided unit substrates 1, 2, etc. to a heat dissipation board. This is the notch. The first and second unit substrates 1, 2, etc. in the substrate block 3 are separated by a dividing line 5 so as to finally form a substantially semicircular planar substrate as shown in FIGS. 4 and 5. It is sectioned.

A first wiring conductor 9 having a pattern as shown in the upper half of FIG. 3 is formed on the first unit board 1 and other unit boards 1a to 1e facing the same direction.
A second wiring conductor 10 having a pattern as shown in the lower half of FIG. 3 is formed on the unit substrate 2 and other unit substrates 2a to 2e facing the same direction. Note that the first and second wiring conductors 9 and 10 are formed, for example, by simultaneously printing silver-palladium-based conductor paste on each unit substrate. In addition, by printing a ruthenium oxide-based resistance paste, the thick film resistors 11, 12, 1 are formed on the first and second unit substrates 1 and 2.
3 and 14 are formed.

The first image conductor 9 and thick film resistors 11 and 12 of the first unit board 1 shown in FIG. 3, and the second wiring conductor 10 and thick film resistors 13 and 14 of the second unit board 2 shown in FIG.
If you compare the transistor mounting part 15,1
All patterns except 6 are rotated 180 degrees. More specifically, from the substrate block 3 to the dividing line 5
When the first and second unit substrates 1 and 2 are divided along the lines and made independent as shown in FIGS. 4 and 5 and aligned in the same direction, the first wiring conductor 9 and the thickness The film resistors 11 and 12, the second wiring conductor 10, and the thick film resistors 13 and 14 have substantially the same pattern as a whole.

The pattern of the first transistor mounting portion 15 on the first unit board 1 is shown in FIG.
5B is arranged and the collector connection wiring conductor 15 is placed on the lower side.
Similarly to the first transistor mounting part 15, the pattern of the second transistor mounting part 16 is such that the emitter and base wiring conductors 16E, 16B are on the upper side, and the collector wiring conductor 16C is on the upper side. It is determined that it will be on the bottom side. That is, the orientations of the first and second unit substrates 1 and 2 and the orientations of the first and second wiring conductors 9 and 10 are
Although they differ by 180 degrees, the orientations of the first and second transistor mounting portions 15 and 16 are determined to be the same.

First and second transistor mounting parts 15,1
first and second transistors 1 mounted on 6;
7 and 18 are both mini-mold transistors and have substantially the same structure. The first and second transistors 17 and 18 are mounted before the substrate block 3 is divided. In the state of the substrate block 3, as is clear from FIG. 3, since the orientations of the first and second transistor mounting portions 15 and 16 are substantially the same,
degree rotation, or one of transistors 17, 18
The first and second transistors 17 and 18 can be mounted without rotating 180 degrees.
Emitter electrode E, base electrode B, collector electrode C
first and second transistors 17, each having
18 to the first and second transistor mounting parts 1
5, 16, the respective wiring conductors 15E,
Solder each electrode to 15B, 15C, 16E, 16B, and 16C.

Thereafter, the substrate block 3 is divided along the dividing line 5 to form independent first and second unit substrates 1 and 2 and other substrates 1a to 1e and 2a as shown in FIGS. 4 and 5. 2e are obtained, these are fixed to the board of each case with adhesive, and the wiring conductors 9,
10 electrode parts 9E, 9B, 9C, 10E, 10
B, 10C are connected to external lead members or other circuit elements and hermetically sealed.

As is clear from the above, this embodiment has the following advantages.

(A) Even if the orientations of the first and second unit boards 1 and 2 and the first and second wiring conductors 9 and 10 are opposite to each other, the orientations of the first and second transistor mounting portions 15 and 16 Since they are the same, it becomes possible to mount the first and second transistors 17 and 18 in the same direction. Therefore, it is no longer necessary to rotate the substrate block 3 or the transistors 17, 18 when mounting the transistors 17, 18, and the transistors 17, 18 have polarity.
can be easily and accurately mounted.

(B) Since the other parts except the transistor mounting parts 15 and 16 are the same in the first and second unit substrates 1 and 2, it is possible to provide a circuit device having substantially the same configuration.

(C) A large number of substrates 1, 2, 1a ~ as shown in Figure 1
Since 1e, 2a to 2e are arranged symmetrically, the effect of shrinkage becomes uniform, and a large number of unit substrates 1, 2, 1a to 1e, and 2a to 2e having the same dimensions can be easily obtained.

(D) Parting line 5 between each semicircular unit board 1, 2, etc.
Since a cutout 7 is provided which has a tapered portion towards , the division can be easily achieved.

(E) Since the unit boards 1, 2, etc. are approximately semicircular and have a cutout 8, this circuit board is suitable for being housed in a metal case such as TO-3 used for a transistor package, etc. equipment can be provided.

Modifications The present invention is not limited to the above-described embodiments, but can be modified as follows, for example.

(a) Instead of arranging unit boards in only two directions,
(However, it may be arranged in the direction of a real number of 3 or more).
That is, a large number of unit substrates may be arranged by rotating them by 360 degrees/n.

(b) It is also applicable to the case where electronic components having polarity such as diodes are arranged in addition to the transistors 17 and 18.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a circuit board block according to an embodiment of the present invention, and FIG. 2 is a plan view showing the circuit board block of FIG. 1 with wiring conductors and thick film resistors formed by a conventional method. 3 is a partially enlarged plan view showing a state in which wiring conductors and thick film resistors are formed on the substrate block of FIG. 1 according to an embodiment of the present invention; FIGS. 4 and 5 are partially enlarged plan views. FIG. 3 is a plan view showing a unit board and a circuit after being divided. DESCRIPTION OF SYMBOLS 1...First unit board, 2...Second unit board, 3...Circuit board block, 5...Dividing line, 9
...first wiring conductor, 10...second wiring conductor,
11, 12, 13, 14... Thick film resistor, 15...
1st transistor mounting part, 16...2nd transistor mounting part, 17...1st transistor, 18...2nd transistor.

Claims (1)

[Claims for Utility Model Registration] (1) To obtain a plurality of circuit devices that are substantially the same electrically and in shape, and by division, at least first and second unit boards having the same external shape are formed. a substrate block formed so as to be obtained, and formed such that the first unit substrate has a first orientation and the second unit substrate has a second orientation; a first wiring conductor formed on the second unit board and formed to include a portion for mounting a polarized electronic component; and a first wiring conductor formed on the second unit board and connecting the board block to the first and second unit boards. When the first and second unit boards are divided into unit boards and the orientations of the first and second unit boards are aligned in the same direction, the pattern is almost the same as the first wiring conductor except for the pattern of the part where the electronic component having the polarity is mounted. The pattern of the portion on which the electronic component having polarity is mounted is determined before dividing the board block so that the connection direction of the electronic component is the same. A circuit board device comprising a wiring conductor. (2) The circuit device has a film resistor in addition to the electronic component having the polarity, and the film resistor is formed by dividing the substrate block into the first and second unit substrates. The circuit board device according to claim 1, wherein the circuit board device is formed so that when the second unit boards are aligned in the same direction, they have the same pattern. (3) The second orientation is an orientation obtained by rotating the first orientation by 180 degrees.
The circuit board device according to item 1 or 2. (4) The circuit board device according to claim 1, 2, or 3, wherein the first and second unit boards are substantially semicircular boards as a whole.