JPH0440558U - - Google Patents
Info
- Publication number
- JPH0440558U JPH0440558U JP8153090U JP8153090U JPH0440558U JP H0440558 U JPH0440558 U JP H0440558U JP 8153090 U JP8153090 U JP 8153090U JP 8153090 U JP8153090 U JP 8153090U JP H0440558 U JPH0440558 U JP H0440558U
- Authority
- JP
- Japan
- Prior art keywords
- network circuit
- conductors
- chip
- wiring board
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図、第３図、第５図及び第７図は、本考案
の各実施例を示す使用状態の平面図、第２図、第
４図、第６図及び第８図は、前記各実施例におけ
るネツトワーク回路の結線図である。
１……絶縁基板、２，３……電極ランド、６，
７，８，９……連続導体、１０……接続導体。
1, 3, 5 and 7 are plan views showing each embodiment of the present invention in a state of use, and FIGS. FIG. 3 is a wiring diagram of a network circuit in an embodiment. 1... Insulating substrate, 2, 3... Electrode land, 6,
7, 8, 9... Continuous conductor, 10... Connection conductor.
Claims (1)
チツプ状電子部品を搭載してネツトワーク回路を
形成するネツトワーク回路用配線基板において、
前記導体パターンが、平行に配置された少なくと
も一対の連続導体６，７及び８，９と、これら連
続導体６，７及び８，９に各々接続されると共に
、その間で対向する複数対のチツプ状電子部品搭
載用の電極ランド、２，３と、これら電極ランド
２，３の間に交互に配置されると共に、前記連続
導体６，７及び８，９を互いに接続する接続導体
１０，１０…とを有することを特徴とするネツト
ワーク回路用配線基板。 In a wiring board for a network circuit in which chip-shaped electronic components are mounted on a conductor pattern formed on an insulating substrate 1 to form a network circuit,
The conductor pattern includes at least one pair of continuous conductors 6, 7 and 8, 9 arranged in parallel, and a plurality of pairs of chip-shaped chips connected to these continuous conductors 6, 7 and 8, 9, respectively, and facing each other between them. Electrode lands 2, 3 for mounting electronic components, connection conductors 10, 10, which are arranged alternately between these electrode lands 2, 3 and connect the continuous conductors 6, 7 and 8, 9 to each other. 1. A wiring board for a network circuit, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8153090U JPH0440558U (en) | 1990-07-31 | 1990-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8153090U JPH0440558U (en) | 1990-07-31 | 1990-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0440558U true JPH0440558U (en) | 1992-04-07 |
Family
ID=31627564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8153090U Pending JPH0440558U (en) | 1990-07-31 | 1990-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440558U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004288476A (en) * | 2003-03-24 | 2004-10-14 | Moritex Corp | Manufacturing method of circular oblique light emitting device, and flexible wiring board |
-
1990
- 1990-07-31 JP JP8153090U patent/JPH0440558U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004288476A (en) * | 2003-03-24 | 2004-10-14 | Moritex Corp | Manufacturing method of circular oblique light emitting device, and flexible wiring board |
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