JPH01146577U - - Google Patents
Info
- Publication number
- JPH01146577U JPH01146577U JP4182888U JP4182888U JPH01146577U JP H01146577 U JPH01146577 U JP H01146577U JP 4182888 U JP4182888 U JP 4182888U JP 4182888 U JP4182888 U JP 4182888U JP H01146577 U JPH01146577 U JP H01146577U
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- block
- conductors corresponding
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000006071 cream Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の実施例を示す要部平面図、第
２図は第１図実施例の印刷配線板に表面実装部品
を実装した状態を示す要部平面図、第３図は第２
図の側断面図、第４図は表面実装部品のＳＯＰの
外観斜視図、第５図は従来の表面実装部品の実装
状態を示す要部平面図、第６図は従来例を示す要
部平面図、第７図は第５図の側断面図である。
１１…印刷配線板、１２…ＳＯＰ、１３…端子
群、１３ａ…電気回路を共通にする端子群、１４
…ブロツク導体、１５…半田レジスト堤、１６…
独立導体、１７…クリーム半田。
Fig. 1 is a plan view of the main part showing an embodiment of the present invention, Fig. 2 is a plan view of the main part showing the printed wiring board of the embodiment shown in Fig.
4 is an external perspective view of the SOP of the surface mount component, FIG. 5 is a plan view of the main part showing the mounting state of the conventional surface mount component, and FIG. 6 is a plan view of the main part showing the conventional example. 7 is a side sectional view of FIG. 5. 11... Printed wiring board, 12... SOP, 13... Terminal group, 13a... Terminal group that shares an electric circuit, 14
...Block conductor, 15...Solder resist bank, 16...
Independent conductor, 17...Cream solder.
Claims (1)
端子にそれぞれ対応する独立導体と、その電気回
路を共通にする複数個の端子に対応するブロツク
導体とが形成された印刷配線板の配線構造におい
て、 前記ブロツク導体上の各端子の対応位置間に帯
状の半田レジスト堤を形成した印刷配線板の配線
構造。[Claims for Utility Model Registration] In order to mount a surface mount component, independent conductors corresponding to a plurality of terminals thereof and block conductors corresponding to a plurality of terminals sharing the same electric circuit are formed. In the wiring structure of a printed wiring board according to the invention, a strip-shaped solder resist embankment is formed between corresponding positions of each terminal on the block conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4182888U JPH01146577U (en) | 1988-03-31 | 1988-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4182888U JPH01146577U (en) | 1988-03-31 | 1988-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146577U true JPH01146577U (en) | 1989-10-09 |
Family
ID=31268257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4182888U Pending JPH01146577U (en) | 1988-03-31 | 1988-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146577U (en) |
-
1988
- 1988-03-31 JP JP4182888U patent/JPH01146577U/ja active Pending
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