JPS62168657U - - Google Patents

Info

Publication number
JPS62168657U
JPS62168657U JP5778986U JP5778986U JPS62168657U JP S62168657 U JPS62168657 U JP S62168657U JP 5778986 U JP5778986 U JP 5778986U JP 5778986 U JP5778986 U JP 5778986U JP S62168657 U JPS62168657 U JP S62168657U
Authority
JP
Japan
Prior art keywords
semiconductor device
power module
intersect
chips
housed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5778986U
Other languages
Japanese (ja)
Other versions
JPH069520Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986057789U priority Critical patent/JPH069520Y2/en
Publication of JPS62168657U publication Critical patent/JPS62168657U/ja
Application granted granted Critical
Publication of JPH069520Y2 publication Critical patent/JPH069520Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの考案の一実施例による半導体装置
を示す図、第２図はこの考案の一実施例装置を装
置に組込む場合の一配線例を示し、ａが平面図、
ｂが側面図である。第３図は従来の半導体装置の
一例を示す図、第４図はこの従来の半導体装置を
装置に組み込んだ場合の配線例を示す図である。 図において、１はパワーモジユール、２は主電
極、３は信号端子（信号電極）、５は主配線、７
はプリント基板、８は信号配線である。 FIG. 1 shows a semiconductor device according to an embodiment of this invention, and FIG. 2 shows an example of wiring when the embodiment of this invention is incorporated into a device, where a is a plan view;
b is a side view. FIG. 3 is a diagram showing an example of a conventional semiconductor device, and FIG. 4 is a diagram showing an example of wiring when this conventional semiconductor device is incorporated into a device. In the figure, 1 is the power module, 2 is the main electrode, 3 is the signal terminal (signal electrode), 5 is the main wiring, 7
is a printed circuit board, and 8 is a signal wiring.

Claims (1)

【実用新案登録請求の範囲】 複数のデイスクリートデバイスのチツプを１個
のモールドパツケージ内に特定の結線状態にて収
納するパワーモジユールにおいて、 そのパワーモジユールの有する全ての電極面が
装置の他の部分と交叉することのない一平面内に
設けられていることを特徴とする半導体装置。[Claims for Utility Model Registration] In a power module in which chips of a plurality of discrete devices are housed in one molded package in a specific connection state, all electrode surfaces of the power module are connected to other parts of the device. 1. A semiconductor device characterized in that the semiconductor device is provided in one plane that does not intersect with the portion of the semiconductor device.
JP1986057789U 1986-04-16 1986-04-16 Semiconductor device Expired - Lifetime JPH069520Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986057789U JPH069520Y2 (en) 1986-04-16 1986-04-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986057789U JPH069520Y2 (en) 1986-04-16 1986-04-16 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS62168657U true JPS62168657U (en) 1987-10-26
JPH069520Y2 JPH069520Y2 (en) 1994-03-09

Family

ID=30887806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986057789U Expired - Lifetime JPH069520Y2 (en) 1986-04-16 1986-04-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH069520Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004152847A (en) * 2002-10-29 2004-05-27 Denso Corp Motor controlling device
JP2008252055A (en) * 2007-03-08 2008-10-16 Fuji Electric Device Technology Co Ltd Semiconductor and method for manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56132760U (en) * 1980-03-06 1981-10-08
JPS60181840U (en) * 1984-05-12 1985-12-03 ファナック株式会社 electromagnetic contactor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56132760U (en) * 1980-03-06 1981-10-08
JPS60181840U (en) * 1984-05-12 1985-12-03 ファナック株式会社 electromagnetic contactor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004152847A (en) * 2002-10-29 2004-05-27 Denso Corp Motor controlling device
JP2008252055A (en) * 2007-03-08 2008-10-16 Fuji Electric Device Technology Co Ltd Semiconductor and method for manufacturing the same

Also Published As

Publication number Publication date
JPH069520Y2 (en) 1994-03-09

Similar Documents

Publication Publication Date Title
JPS62168657U (en)
JPH01129865U (en)
JPS6416671U (en)
JPS58118774U (en) electronic circuit package
JPS61127666U (en)
JPS6232544U (en)
JPH0295247U (en)
JPS62170646U (en)
JPH0289852U (en)
JPS6157540U (en)
JPH0388318U (en)
JPS6247171U (en)
JPS6115753U (en) semiconductor equipment
JPS6365264U (en)
JPS6391178U (en)
JPS6061742U (en) integrated circuit device
JPS59182986U (en) delay device
JPS6315031U (en)
JPS63164245U (en)
JPS59185853U (en) Metal package for microwave integrated circuits
JPS62140754U (en)
JPS6343430U (en)
JPS6228474U (en)
JPH01140878U (en)
JPH01119169U (en)