JPS59185853U - Metal package for microwave integrated circuits - Google Patents

Metal package for microwave integrated circuits

Info

Publication number
JPS59185853U
JPS59185853U JP8009183U JP8009183U JPS59185853U JP S59185853 U JPS59185853 U JP S59185853U JP 8009183 U JP8009183 U JP 8009183U JP 8009183 U JP8009183 U JP 8009183U JP S59185853 U JPS59185853 U JP S59185853U
Authority
JP
Japan
Prior art keywords
metal package
microwave integrated
integrated circuits
high frequency
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8009183U
Other languages
Japanese (ja)
Inventor
茂 斎藤
小宮 和男
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP8009183U priority Critical patent/JPS59185853U/en
Publication of JPS59185853U publication Critical patent/JPS59185853U/en
Pending legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a、  bは従来の二種類のマイクロ波集積−回
路用金属パッケージの平面図と側面図、第2図a、  
bは第1図a、  bに示す金属パッケージが他のマイ
クロ波集積回路と接続した状態のそれぞれの側面図、第
3図a、  bは本考案マイクロ波集積回路用金属パッ
ケージの平面図と側面図、第4図a、  bは第3図に
示す金属パッケージが他のマイクロ波集積回路と接続し
た状態の平面図と側面図である。− 1・・・金属パッケージ、2・・・高周波用入力端子、
3・・・高周波用出力端子、4. 5. 6. 7・・
・バイアス端子。゛
Figures 1a and 1b are plan and side views of two conventional microwave integrated circuit metal packages, and Figures 2a and 2b are
1b is a side view of the metal package shown in FIGS. 1a and 1b connected to another microwave integrated circuit, and FIGS. 3a and 3b are a plan view and side view of the metal package for a microwave integrated circuit of the present invention. 4a and 4b are a plan view and a side view of the metal package shown in FIG. 3 connected to another microwave integrated circuit. - 1...metal package, 2...high frequency input terminal,
3...High frequency output terminal, 4. 5. 6. 7...
・Bias terminal.゛

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 高周波用の入力端子と出力端子、及び複数のバイアス端
子を有するマイクロ波集積回路用金属パッケージにおい
て、前記高周波用入力端子と出力端子を前記金属パッケ
ージの同じ側面に配置し、前記バイアス端子を他の側面
に配置したことを特徴とするマイクロ波集積回路用金属
パッケージ。
In a metal package for a microwave integrated circuit having a high frequency input terminal and an output terminal, and a plurality of bias terminals, the high frequency input terminal and the output terminal are arranged on the same side of the metal package, and the bias terminal is arranged on the same side of the metal package. A metal package for microwave integrated circuits characterized by being placed on the side.
JP8009183U 1983-05-27 1983-05-27 Metal package for microwave integrated circuits Pending JPS59185853U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8009183U JPS59185853U (en) 1983-05-27 1983-05-27 Metal package for microwave integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8009183U JPS59185853U (en) 1983-05-27 1983-05-27 Metal package for microwave integrated circuits

Publications (1)

Publication Number Publication Date
JPS59185853U true JPS59185853U (en) 1984-12-10

Family

ID=30210082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8009183U Pending JPS59185853U (en) 1983-05-27 1983-05-27 Metal package for microwave integrated circuits

Country Status (1)

Country Link
JP (1) JPS59185853U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01106501A (en) * 1987-10-19 1989-04-24 Fujitsu Ltd Microwave/millimeter wave module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01106501A (en) * 1987-10-19 1989-04-24 Fujitsu Ltd Microwave/millimeter wave module

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