JPS59185853U - Metal package for microwave integrated circuits - Google Patents
Metal package for microwave integrated circuitsInfo
- Publication number
- JPS59185853U JPS59185853U JP8009183U JP8009183U JPS59185853U JP S59185853 U JPS59185853 U JP S59185853U JP 8009183 U JP8009183 U JP 8009183U JP 8009183 U JP8009183 U JP 8009183U JP S59185853 U JPS59185853 U JP S59185853U
- Authority
- JP
- Japan
- Prior art keywords
- metal package
- microwave integrated
- integrated circuits
- high frequency
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図a、 bは従来の二種類のマイクロ波集積−回
路用金属パッケージの平面図と側面図、第2図a、
bは第1図a、 bに示す金属パッケージが他のマイ
クロ波集積回路と接続した状態のそれぞれの側面図、第
3図a、 bは本考案マイクロ波集積回路用金属パッ
ケージの平面図と側面図、第4図a、 bは第3図に
示す金属パッケージが他のマイクロ波集積回路と接続し
た状態の平面図と側面図である。−
1・・・金属パッケージ、2・・・高周波用入力端子、
3・・・高周波用出力端子、4. 5. 6. 7・・
・バイアス端子。゛Figures 1a and 1b are plan and side views of two conventional microwave integrated circuit metal packages, and Figures 2a and 2b are
1b is a side view of the metal package shown in FIGS. 1a and 1b connected to another microwave integrated circuit, and FIGS. 3a and 3b are a plan view and side view of the metal package for a microwave integrated circuit of the present invention. 4a and 4b are a plan view and a side view of the metal package shown in FIG. 3 connected to another microwave integrated circuit. - 1...metal package, 2...high frequency input terminal,
3...High frequency output terminal, 4. 5. 6. 7...
・Bias terminal.゛
Claims (1)
子を有するマイクロ波集積回路用金属パッケージにおい
て、前記高周波用入力端子と出力端子を前記金属パッケ
ージの同じ側面に配置し、前記バイアス端子を他の側面
に配置したことを特徴とするマイクロ波集積回路用金属
パッケージ。In a metal package for a microwave integrated circuit having a high frequency input terminal and an output terminal, and a plurality of bias terminals, the high frequency input terminal and the output terminal are arranged on the same side of the metal package, and the bias terminal is arranged on the same side of the metal package. A metal package for microwave integrated circuits characterized by being placed on the side.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8009183U JPS59185853U (en) | 1983-05-27 | 1983-05-27 | Metal package for microwave integrated circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8009183U JPS59185853U (en) | 1983-05-27 | 1983-05-27 | Metal package for microwave integrated circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59185853U true JPS59185853U (en) | 1984-12-10 |
Family
ID=30210082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8009183U Pending JPS59185853U (en) | 1983-05-27 | 1983-05-27 | Metal package for microwave integrated circuits |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59185853U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01106501A (en) * | 1987-10-19 | 1989-04-24 | Fujitsu Ltd | Microwave/millimeter wave module |
-
1983
- 1983-05-27 JP JP8009183U patent/JPS59185853U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01106501A (en) * | 1987-10-19 | 1989-04-24 | Fujitsu Ltd | Microwave/millimeter wave module |
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