JPS59189250U - Mounting package for semiconductor elements - Google Patents

Mounting package for semiconductor elements

Info

Publication number
JPS59189250U
JPS59189250U JP8445583U JP8445583U JPS59189250U JP S59189250 U JPS59189250 U JP S59189250U JP 8445583 U JP8445583 U JP 8445583U JP 8445583 U JP8445583 U JP 8445583U JP S59189250 U JPS59189250 U JP S59189250U
Authority
JP
Japan
Prior art keywords
semiconductor elements
mounting package
center
semiconductor element
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8445583U
Other languages
Japanese (ja)
Inventor
二郎 橋爪
達彦 入江
茂成 高見
敏行 山口
Original Assignee
松下電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電工株式会社 filed Critical 松下電工株式会社
Priority to JP8445583U priority Critical patent/JPS59189250U/en
Publication of JPS59189250U publication Critical patent/JPS59189250U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図乃至第４図は背景技術を示す図で、第１図は平面
図、第２図は側面図、第３図は平面図、第４図は第３図
の裏面図、第５図及び第６図はこの考案の一実施例を示
す図で、第５図は平面図、第６図は裏面図である。Figures 1 to 4 are diagrams showing the background art, where Figure 1 is a plan view, Figure 2 is a side view, Figure 3 is a plan view, Figure 4 is a back view of Figure 3, and Figure 5. 6 are views showing an embodiment of this invention, FIG. 5 is a plan view, and FIG. 6 is a back view.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路を中央より放射状に形成せる電気回路基板の中央に
半導体素子を実装し、半導体素子と回路線をワイヤーボ
ンディングし、回路線に基板裏面の電極に至るスルホー
ルを非直線状配列に配置してなる半導体素子の実装パッ
ケージ。A semiconductor element is mounted in the center of an electric circuit board that allows circuits to be formed radially from the center, the semiconductor element and circuit lines are wire-bonded, and through-holes are arranged in a non-linear arrangement in the circuit lines to reach the electrodes on the back of the board. Mounting package for semiconductor elements.
JP8445583U 1983-05-31 1983-05-31 Mounting package for semiconductor elements Pending JPS59189250U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8445583U JPS59189250U (en) 1983-05-31 1983-05-31 Mounting package for semiconductor elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8445583U JPS59189250U (en) 1983-05-31 1983-05-31 Mounting package for semiconductor elements

Publications (1)

Publication Number Publication Date
JPS59189250U true JPS59189250U (en) 1984-12-15

Family

ID=30214404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8445583U Pending JPS59189250U (en) 1983-05-31 1983-05-31 Mounting package for semiconductor elements

Country Status (1)

Country Link
JP (1) JPS59189250U (en)

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