JPS6287479U - - Google Patents

Info

Publication number
JPS6287479U
JPS6287479U JP17932885U JP17932885U JPS6287479U JP S6287479 U JPS6287479 U JP S6287479U JP 17932885 U JP17932885 U JP 17932885U JP 17932885 U JP17932885 U JP 17932885U JP S6287479 U JPS6287479 U JP S6287479U
Authority
JP
Japan
Prior art keywords
circuit boards
conduction
circuit
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17932885U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17932885U priority Critical patent/JPS6287479U/ja
Publication of JPS6287479U publication Critical patent/JPS6287479U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図は従来の導通構造の実施例を示
す断面図である。第３図は、本考案の導通構造の
斜視図。第４図ａ〜ｃは、端面部断面パターンを
形成させるための加工手順図。第５図は、本考案
を用いた場合の構造断面図。第６図は、本考案を
応用し、サブ基板を避けた形で、電子素子を配置
した図。 FIGS. 1 and 2 are cross-sectional views showing examples of conventional conductive structures. FIG. 3 is a perspective view of the conductive structure of the present invention. FIGS. 4a to 4c are processing procedure diagrams for forming an end face cross-sectional pattern. FIG. 5 is a cross-sectional view of the structure when the present invention is used. FIG. 6 is a diagram in which electronic elements are arranged by applying the present invention and avoiding the sub-board.

Claims (1)

【実用新案登録請求の範囲】 (1) 小型電子機器の回路ブロツクが、少なくと
も２枚の回路基板を有し、回路基板間の導通をと
る構造に於いて、前記回路基板の端面断面部に導
通パターンを有し、他の回路基板と断面部パター
ンを直接半田付けすることで回路基板間の導通を
とることを特徴とする回路基板間の導通構造。 (2) 前記回路基板間の導通構造に於いて、少な
くとも、前記回路基板の導通された回路基板のま
わりにＩＣ及び電気素子等を配置したことを特徴
とする実用新案登録請求の範囲第１項記載の回路
基板間の導通構造。[Claims for Utility Model Registration] (1) A circuit block of a small electronic device has at least two circuit boards, and in a structure that provides conduction between the circuit boards, the circuit block has a structure in which conduction is established between the end faces of the circuit boards. A conductive structure between circuit boards, which has a pattern and is characterized in that conduction between the circuit boards is achieved by directly soldering the cross-sectional pattern to another circuit board. (2) In the conduction structure between the circuit boards, at least an IC, an electric element, etc. are arranged around the circuit board that is electrically connected, as claimed in claim 1 of the utility model registration. Conductive structure between the described circuit boards.
JP17932885U 1985-11-21 1985-11-21 Pending JPS6287479U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17932885U JPS6287479U (en) 1985-11-21 1985-11-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17932885U JPS6287479U (en) 1985-11-21 1985-11-21

Publications (1)

Publication Number Publication Date
JPS6287479U true JPS6287479U (en) 1987-06-04

Family

ID=31122288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17932885U Pending JPS6287479U (en) 1985-11-21 1985-11-21

Country Status (1)

Country Link
JP (1) JPS6287479U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03181191A (en) * 1989-12-11 1991-08-07 Sanken Electric Co Ltd Printed wiring board
JPH07183451A (en) * 1993-11-16 1995-07-21 Internatl Business Mach Corp <Ibm> Module with chip dilectly attached

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6059538B2 (en) * 1980-09-26 1985-12-25 株式会社日立製作所 Emission spectrometer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6059538B2 (en) * 1980-09-26 1985-12-25 株式会社日立製作所 Emission spectrometer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03181191A (en) * 1989-12-11 1991-08-07 Sanken Electric Co Ltd Printed wiring board
JPH07183451A (en) * 1993-11-16 1995-07-21 Internatl Business Mach Corp <Ibm> Module with chip dilectly attached

Similar Documents

Publication Publication Date Title
JPS6287479U (en)
JPS58195484U (en) Printed circuit board mounting structure
JPH0310568U (en)
JPH031469U (en)
JPS6232573U (en)
JPH0365276U (en)
JPS59121175U (en) terminal mounting device
JPS6066068U (en) Chip parts mounting device
JPS60101774U (en) Printed board
JPH0188470U (en)
JPS583057U (en) printed circuit board circuit unit
JPS59177969U (en) Printed circuit board connection device
JPS5918459U (en) Electrical element mounting structure
JPS63179681U (en)
JPS6248674U (en)
JPH01129885U (en)
JPS62204373U (en)
JPS63147863U (en)
JPH01163343U (en)
JPH0317665U (en)
JPS6157564U (en)
JPS62120314U (en)
JPH0412678U (en)
JPS6073271U (en) printed wiring board
JPS61131874U (en)