JPS6255346U - - Google Patents
Info
- Publication number
- JPS6255346U JPS6255346U JP14716485U JP14716485U JPS6255346U JP S6255346 U JPS6255346 U JP S6255346U JP 14716485 U JP14716485 U JP 14716485U JP 14716485 U JP14716485 U JP 14716485U JP S6255346 U JPS6255346 U JP S6255346U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- pattern
- soldered
- dissipation mechanism
- another
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案によるＩＣの放熱機構を示す平
面図、第２図はその断面拡大図、第３図は従来の
ＩＣの放熱機構を示す平面図、第４図はその断面
拡大図である。
１……ＩＣ、２……放熱用の端子、３……回路
接続用の端子、１１……基板、１２……絶縁被膜
、１３ａ，１３ｂ……放熱板を固定するグランド
パターン、１４……導体パターン、１６……放熱
板。
Fig. 1 is a plan view showing the heat dissipation mechanism of an IC according to the present invention, Fig. 2 is an enlarged cross-sectional view thereof, Fig. 3 is a plan view showing the heat dissipation mechanism of a conventional IC, and Fig. 4 is an enlarged cross-sectional view thereof. . 1... IC, 2... Terminal for heat dissipation, 3... Terminal for circuit connection, 11... Board, 12... Insulating coating, 13a, 13b... Ground pattern for fixing the heat sink, 14... Conductor Pattern, 16... Heat sink.
Claims (1)
、基板上のパターンに半田付けされており、且つ
ＩＣを覆うように設けられた金属製の放熱板の両
端が前記パターンに半田付けされて成るＩＣの放
熱機構。 (2) 放熱板が半田付けされるパターンは、ＩＣ
の両側に分離されて形成されており、且つＩＣの
他の端子が接続される他のパターンが、前記パタ
ーンの中間に形成されている実用新案登録請求の
範囲第１項記載のＩＣの放熱機構。 (3) 放熱板は、ＩＣの上面に固定されている実
用新案登録請求の範囲第１項記載のＩＣの放熱機
構。[Claims for Utility Model Registration] (1) Heat dissipation terminals extending from both sides of the IC are soldered to patterns on the board, and a metal heat dissipation plate is provided to cover the IC. A heat dissipation mechanism for an IC having both ends soldered to the pattern. (2) The pattern to which the heat sink is soldered is the IC
A heat dissipation mechanism for an IC according to claim 1, wherein another pattern to which another terminal of the IC is connected is formed in the middle of the pattern. . (3) The heat dissipation mechanism for an IC according to claim 1, wherein the heat dissipation plate is fixed to the top surface of the IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14716485U JPS6255346U (en) | 1985-09-25 | 1985-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14716485U JPS6255346U (en) | 1985-09-25 | 1985-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6255346U true JPS6255346U (en) | 1987-04-06 |
Family
ID=31060278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14716485U Pending JPS6255346U (en) | 1985-09-25 | 1985-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6255346U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687303A (en) * | 2012-09-11 | 2014-03-26 | Ls产电株式会社 | Coupling assembly of power semiconductor device and PCB and method for manufacturing the same |
| JP2014170834A (en) * | 2013-03-04 | 2014-09-18 | Mitsubishi Electric Corp | Heat radiation structure of power semiconductor and audio device using the same |
-
1985
- 1985-09-25 JP JP14716485U patent/JPS6255346U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687303A (en) * | 2012-09-11 | 2014-03-26 | Ls产电株式会社 | Coupling assembly of power semiconductor device and PCB and method for manufacturing the same |
| JP2014057066A (en) * | 2012-09-11 | 2014-03-27 | Lsis Co Ltd | Coupling assembly of power element and pcb and manufacturing method of the same |
| JP2014170834A (en) * | 2013-03-04 | 2014-09-18 | Mitsubishi Electric Corp | Heat radiation structure of power semiconductor and audio device using the same |