JPH038468U - - Google Patents
Info
- Publication number
- JPH038468U JPH038468U JP6748989U JP6748989U JPH038468U JP H038468 U JPH038468 U JP H038468U JP 6748989 U JP6748989 U JP 6748989U JP 6748989 U JP6748989 U JP 6748989U JP H038468 U JPH038468 U JP H038468U
- Authority
- JP
- Japan
- Prior art keywords
- connection
- electronic component
- component body
- circuit board
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000006071 cream Substances 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案に係る回路基板装置を示す断面
図、第２図は第１図の接続パターンを示す平面図
、第３図は従来の回路基板装置を示す断面図、第
４図は第３図中の接続パターンを示す平面図であ
る。
１……回路基板、３……接続パターン、３ａ…
…第１の接続領域（第１の接続パターン）、３ｂ
……第２の接続領域（第２の接続パターン）、５
……電子部品本体（コネクタ本体）、７……接続
ピン、９……半田、１１，１３……半田レジスト
。
FIG. 1 is a sectional view showing a circuit board device according to the present invention, FIG. 2 is a plan view showing the connection pattern of FIG. 1, FIG. 3 is a sectional view showing a conventional circuit board device, and FIG. FIG. 3 is a plan view showing the connection pattern in FIG. 3; 1... Circuit board, 3... Connection pattern, 3a...
...first connection area (first connection pattern), 3b
...Second connection area (second connection pattern), 5
...Electronic component body (connector body), 7... Connection pin, 9... Solder, 11, 13... Solder resist.
Claims (1)
と、 この接続パターンに部分的に重ねて前記回路基
板に載置された電子部品本体と、 この電子部品本体から突出して前記接続パター
ンに重なるようにしてクリーム半田で半田付けさ
れた接続ピンと、 を具備し、 前記電子部品本体と重なる領域を含む第１の接
続領域および前記電子部品本体と重ならない第２
の接続領域とに前記接続パターンが複数分割され
るとともに、 前記接続ピンが前記第２の接続領域に延びて半
田付けされてなることを特徴とする回路基板装置
。[Claims for Utility Model Registration] A connection pattern formed on an insulating circuit board, an electronic component body placed on the circuit board partially overlapping the connection pattern, and a part protruding from the electronic component body. a connection pin soldered with cream solder so as to overlap the connection pattern; a first connection area including an area overlapping with the electronic component body; and a second connection area that does not overlap with the electronic component body.
A circuit board device, wherein the connection pattern is divided into a plurality of connection areas, and the connection pin extends to the second connection area and is soldered thereto.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6748989U JPH0729657Y2 (en) | 1989-06-09 | 1989-06-09 | Circuit board device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6748989U JPH0729657Y2 (en) | 1989-06-09 | 1989-06-09 | Circuit board device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH038468U true JPH038468U (en) | 1991-01-28 |
| JPH0729657Y2 JPH0729657Y2 (en) | 1995-07-05 |
Family
ID=31601105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6748989U Expired - Lifetime JPH0729657Y2 (en) | 1989-06-09 | 1989-06-09 | Circuit board device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0729657Y2 (en) |
-
1989
- 1989-06-09 JP JP6748989U patent/JPH0729657Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0729657Y2 (en) | 1995-07-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |