JPS62142875U - - Google Patents
Info
- Publication number
- JPS62142875U JPS62142875U JP2918586U JP2918586U JPS62142875U JP S62142875 U JPS62142875 U JP S62142875U JP 2918586 U JP2918586 U JP 2918586U JP 2918586 U JP2918586 U JP 2918586U JP S62142875 U JPS62142875 U JP S62142875U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- solder
- board circuit
- resist layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の実施例を示す要部平面図、第
２図は第１図の側断面図、第３図は半田レジスト
層の逃げ部詳細図、第４図は寸法の異なる複数種
のチツプ部品実装の要部平面図、第５図は第４図
の半田レジスト逃げ部詳細図、第６図は従来装置
の要部平面図、第７図は第６図の側断面図である
。
１１…印刷配線板、１２…導体層、１２ａ…半
田ランド部、１３…チツプ部品、１３ａ…電極部
、１４…半田レジスト層、１４ａ…逃げ部、１５
…半田、１６…接着剤、１７，１８…チツプ部品
、１９，２０…半田レジント層、１９ａ，２０ａ
…逃げ部。
FIG. 1 is a plan view of the main part showing an embodiment of the present invention, FIG. 2 is a side sectional view of FIG. 5 is a detailed view of the solder resist relief part of FIG. 4, FIG. 6 is a plan view of the main part of the conventional device, and FIG. 7 is a side sectional view of FIG. 6. . DESCRIPTION OF SYMBOLS 11... Printed wiring board, 12... Conductor layer, 12a... Solder land part, 13... Chip component, 13a... Electrode part, 14... Solder resist layer, 14a... Relief part, 15
...Solder, 16...Adhesive, 17,18...Chip parts, 19,20...Solder resin layer, 19a, 20a
...Escape club.
Claims (1)
半田ランド上に、大きさ、電極幅などが異なりリ
ード線のない電気部品を実装する印刷配線板の回
路構造において、 前記電気部品に対応する大きさの逃げ部を有す
る半田レジスト層を前記半田ランド上に重畳して
形成する ことを特徴とする印刷配線板回路構造。[Claim for Utility Model Registration] A printed wiring board circuit in which electrical components of different sizes, electrode widths, etc. and no lead wires are mounted on solder lands of a certain size arranged on the printed wiring board. A printed wiring board circuit structure, characterized in that a solder resist layer having a relief portion of a size corresponding to the electrical component is formed to overlap the solder land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2918586U JPS62142875U (en) | 1986-03-03 | 1986-03-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2918586U JPS62142875U (en) | 1986-03-03 | 1986-03-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62142875U true JPS62142875U (en) | 1987-09-09 |
Family
ID=30832848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2918586U Pending JPS62142875U (en) | 1986-03-03 | 1986-03-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62142875U (en) |
-
1986
- 1986-03-03 JP JP2918586U patent/JPS62142875U/ja active Pending
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