JPS646063U - - Google Patents

Info

Publication number
JPS646063U
JPS646063U JP10151887U JP10151887U JPS646063U JP S646063 U JPS646063 U JP S646063U JP 10151887 U JP10151887 U JP 10151887U JP 10151887 U JP10151887 U JP 10151887U JP S646063 U JPS646063 U JP S646063U
Authority
JP
Japan
Prior art keywords
electronic component
leaded
leadless
wiring body
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10151887U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10151887U priority Critical patent/JPS646063U/ja
Publication of JPS646063U publication Critical patent/JPS646063U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は本考案に係るプリント配線
体の一実施例を示す側面図及び平面図、第3図及
び第4図は従来のプリント配線体を示す側面図及
び平面図である。 11……プリント基板、12……導電ランド、
13……リード付き電子部品、13b……リード
、14……リードレス電子部品、14b……電極
、15……半田。
1 and 2 are a side view and a plan view showing an embodiment of a printed wiring body according to the present invention, and FIGS. 3 and 4 are a side view and a plan view showing a conventional printed wiring body. 11... Printed circuit board, 12... Conductive land,
13...Leaded electronic component, 13b...Lead, 14...Leadless electronic component, 14b...Electrode, 15...Solder.

Claims (1)

【実用新案登録請求の範囲】 プリント基板の導電パターンが形成された面上
にリード付き電子部品とリードレス電子部品とを
実装したものであつて、 上記リード付き電子部品のリードをリードレス
電子部品の電極上に重合接続したことを特徴とす
るプリント配線体。
[Scope of Claim for Utility Model Registration] A leaded electronic component and a leadless electronic component are mounted on the surface of a printed circuit board on which a conductive pattern is formed, and the leads of the leaded electronic component are mounted as a leadless electronic component. A printed wiring body characterized by polymerization connection on an electrode.
JP10151887U 1987-06-30 1987-06-30 Pending JPS646063U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10151887U JPS646063U (en) 1987-06-30 1987-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10151887U JPS646063U (en) 1987-06-30 1987-06-30

Publications (1)

Publication Number Publication Date
JPS646063U true JPS646063U (en) 1989-01-13

Family

ID=31330589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10151887U Pending JPS646063U (en) 1987-06-30 1987-06-30

Country Status (1)

Country Link
JP (1) JPS646063U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0420261U (en) * 1990-06-11 1992-02-20

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0420261U (en) * 1990-06-11 1992-02-20

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