JPS624173U - - Google Patents
Info
- Publication number
- JPS624173U JPS624173U JP2815785U JP2815785U JPS624173U JP S624173 U JPS624173 U JP S624173U JP 2815785 U JP2815785 U JP 2815785U JP 2815785 U JP2815785 U JP 2815785U JP S624173 U JPS624173 U JP S624173U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductor
- common conductive
- chip component
- conductive land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の実施例を示す縦断面図、第２
図は半田付け前の状態を示す平面図、第３図は従
来例を示す縦断面図、第４図は半田付け前の状態
を示す平面図である。
１……プリント配線基板、２……半田付けラン
ド、３……スルーホール、４……導電体、５……
チツプ部品、６……除去部分、７……レジスト膜
。
Fig. 1 is a vertical sectional view showing an embodiment of the present invention;
The figure is a plan view showing the state before soldering, FIG. 3 is a vertical sectional view showing a conventional example, and FIG. 4 is a plan view showing the state before soldering. 1...Printed wiring board, 2...Soldering land, 3...Through hole, 4...Conductor, 5...
Chip parts, 6...Removed portion, 7...Resist film.
Claims (1)
設すると共に、この導電体に近接してチツプ部品
を配置し、両者を共通の導電ランドに半田付けす
るプリント配線体において、 前記共通の導電ランドは前記スルーホールと前
記チツプ部品の配置位置との間を前記スルーホー
ル側の一部分を切欠して除去すると共に、この間
に半田レジストを被着し、前記導電体と前記チツ
プ部品間の半田付けをしたことを特徴とするチツ
プ部品搭載プリント配線構体。[Scope of Claim for Utility Model Registration] In a printed wiring body in which a conductor is disposed through a through hole of a printed circuit board, a chip component is placed in close proximity to the conductor, and both are soldered to a common conductive land. , the common conductive land is removed by cutting out a part of the through hole side between the through hole and the location where the chip component is disposed, and a solder resist is applied between the through hole and the common conductive land is connected to the conductor and the chip component. A printed wiring structure equipped with chip components characterized by soldering between components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2815785U JPS624173U (en) | 1985-02-27 | 1985-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2815785U JPS624173U (en) | 1985-02-27 | 1985-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS624173U true JPS624173U (en) | 1987-01-12 |
Family
ID=30525780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2815785U Pending JPS624173U (en) | 1985-02-27 | 1985-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS624173U (en) |
-
1985
- 1985-02-27 JP JP2815785U patent/JPS624173U/ja active Pending