JPS6240869U - - Google Patents
Info
- Publication number
- JPS6240869U JPS6240869U JP13256385U JP13256385U JPS6240869U JP S6240869 U JPS6240869 U JP S6240869U JP 13256385 U JP13256385 U JP 13256385U JP 13256385 U JP13256385 U JP 13256385U JP S6240869 U JPS6240869 U JP S6240869U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- solder
- chip components
- shorts
- pattern structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000007654 immersion Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の銅貼付回路基板のパターン構
造の一実施例を示す平面図。第２図は従来の回路
基板のパターン構造を示す平面図。
１…回路基板、２…パターン、３…チツプ部品
。
FIG. 1 is a plan view showing one embodiment of the pattern structure of the copper-bonded circuit board of the present invention. FIG. 2 is a plan view showing the pattern structure of a conventional circuit board. 1...Circuit board, 2...Pattern, 3...Chip parts.
Claims (1)
板においてチツプ部品のはんだシヨート、オープ
ンを、チツプ部品の配置を基板辺方向と傾斜した
方向に配置し、チツプ部品をはんだシヨート防止
することを特徴とする銅貼付回路基板のパターン
構造。 Copper pasting, which is characterized by arranging the solder shorts and opens of chip components in a direction inclined to the board side direction on a circuit board that is soldered by solder immersion flow, and preventing solder shorts of the chip components. Circuit board pattern structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13256385U JPS6240869U (en) | 1985-08-30 | 1985-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13256385U JPS6240869U (en) | 1985-08-30 | 1985-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6240869U true JPS6240869U (en) | 1987-03-11 |
Family
ID=31032067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13256385U Pending JPS6240869U (en) | 1985-08-30 | 1985-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240869U (en) |
-
1985
- 1985-08-30 JP JP13256385U patent/JPS6240869U/ja active Pending