JPS62120380U - - Google Patents
Info
- Publication number
- JPS62120380U JPS62120380U JP735486U JP735486U JPS62120380U JP S62120380 U JPS62120380 U JP S62120380U JP 735486 U JP735486 U JP 735486U JP 735486 U JP735486 U JP 735486U JP S62120380 U JPS62120380 U JP S62120380U
- Authority
- JP
- Japan
- Prior art keywords
- land
- view
- printed wiring
- wiring board
- plan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例に係るプリント配線
基板に電子部品を搭載した状態を示す要部の平面
図、第２図は第１図の切断面線Ａ―Ａから見た断
面図、第３図は半田付けが終了した状態を示す第
１図に対応する平面図、第４図は第３図の切断面
線Ａ′―Ａ′から見た断面図、第５図は従来例の
プリント配線基板上にチツプ型の電子部品を搭載
した状態を示す要部の平面図、第６図は第５図の
切断面線Ｂ―Ｂから見た断面図、第７図はデイツ
プソルダリングによる半田接続作業を説明するた
めの側面図、第８図はデイツプソルダリングによ
る半田付けが終了した状態を示す第５図に対応す
る平面図であり、第９図は第８図の切断面線Ｂ′
―Ｂ′から見た断面図である。
１，１０……プリント配線基板、２……電子部
品、３……基板本体、４……導体部分、５……ラ
ンド、６……レジスト膜、７……貫通孔、８，１
１……半田。
FIG. 1 is a plan view of essential parts showing a state in which electronic components are mounted on a printed wiring board according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken from the section line AA in FIG. FIG. 3 is a plan view corresponding to FIG. 1 showing a state in which soldering is completed, FIG. A plan view of the main parts showing a state in which chip-type electronic components are mounted on a printed wiring board, Figure 6 is a cross-sectional view taken from the cutting plane line B-B in Figure 5, and Figure 7 is deep soldering. 8 is a plan view corresponding to FIG. 5 showing a state in which soldering by dip soldering is completed, and FIG. 9 is a cross-sectional view of FIG. 8. Line B'
- It is a sectional view seen from B'. 1, 10... Printed wiring board, 2... Electronic component, 3... Board body, 4... Conductor portion, 5... Land, 6... Resist film, 7... Through hole, 8, 1
1...Solder.
Claims (1)
るプリント配線基板において、 前記ランドの境界付近に、貫通孔が形成されて
なるプリント配線基板。[Claims for Utility Model Registration] A printed wiring board in which a component terminal is soldered to a land of a conductor portion, wherein a through hole is formed near the boundary of the land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP735486U JPS62120380U (en) | 1986-01-21 | 1986-01-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP735486U JPS62120380U (en) | 1986-01-21 | 1986-01-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62120380U true JPS62120380U (en) | 1987-07-30 |
Family
ID=30790726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP735486U Pending JPS62120380U (en) | 1986-01-21 | 1986-01-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62120380U (en) |
-
1986
- 1986-01-21 JP JP735486U patent/JPS62120380U/ja active Pending