JPS6275607U

JPS6275607U -

Info

Publication number: JPS6275607U
Application number: JP16657385U
Authority: JP
Priority date: 1985-10-31
Filing date: 1985-10-31
Publication date: 1987-05-14

Description

[Brief explanation of the drawing]

第１図乃至第４図は、本考案に係るＭＩＣケー
スの第１の実施例を説明する図であり、第１図は
ＭＩＣケースの平面図、第２図は第１図の―
線断面図、第３図は第１図の―線拡大断面図
、第４図は第１図のＭＩＣケースに誘電体基板を
半田付けする状態を示す断面図である。また、第
５図は本考案に係るＭＩＣケースの第２の実施例
を説明する平面図であり、第６図は第５図の―
線断面図である。第７図乃至第１０図は従来の
ＭＩＣケースを説明する図であり、第７図はＭＩ
Ｃケースに誘電体基板を半田付けする状態を示す
断面図、第８図は第７図の円部拡大図、第９図ａ
，ｂはＭＩＣケースを示す平面図及び側面図、第
１０図ａ，ｂは他のＭＩＣケースを示す平面図及
び側断面図。１……誘電体基板、３……アースパターン面、
１２……クリーム半田、１３……誘電体基板の周
縁、１４……スルーホール、２０，２０Ａ……Ｍ
ＩＣケース、２１……基板取付面、２２，２２Ａ
……半田溜め用の溝。 1 to 4 are diagrams for explaining the first embodiment of the MIC case according to the present invention. FIG. 1 is a plan view of the MIC case, and FIG.
3 is an enlarged sectional view taken along the line ``--'' in FIG. 1, and FIG. 4 is a sectional view showing a state in which a dielectric substrate is soldered to the MIC case of FIG. 1. Further, FIG. 5 is a plan view for explaining the second embodiment of the MIC case according to the present invention, and FIG. 6 is a plan view of the second embodiment of the MIC case according to the present invention.
FIG. 7 to 10 are diagrams explaining the conventional MIC case, and FIG.
A cross-sectional view showing how the dielectric board is soldered to the C case, Figure 8 is an enlarged view of the circle in Figure 7, Figure 9a
, b are a plan view and a side view showing the MIC case, and FIGS. 10a and 10b are a plan view and side sectional view showing another MIC case. 1... Dielectric substrate, 3... Earth pattern surface,
12...Cream solder, 13...Periphery of dielectric substrate, 14...Through hole, 20, 20A...M
IC case, 21... Board mounting surface, 22, 22A
...Groove for solder reservoir.

Claims

[Scope of Claim for Utility Model Registration] (1) In a microwave integrated circuit case that is soldered to a ground pattern formed on a dielectric substrate by reflow, a solder reservoir is provided on the mounting surface of the board that is soldered to the ground pattern. A microwave integrated circuit case characterized by having a groove formed therein. (2) Utility model registration claim (1) characterized in that the groove for the solder reservoir is formed on the board mounting surface so as to be located near the periphery of the dielectric board to be soldered. Case for the microwave integrated circuit described. (3) Utility model registration claim (1) characterized in that the groove for soldering is formed on the board mounting surface so as to be located near the through hole of the dielectric board to be soldered. A case for microwave integrated circuits as described in section.