JPH032673U - - Google Patents
Info
- Publication number
- JPH032673U JPH032673U JP6303989U JP6303989U JPH032673U JP H032673 U JPH032673 U JP H032673U JP 6303989 U JP6303989 U JP 6303989U JP 6303989 U JP6303989 U JP 6303989U JP H032673 U JPH032673 U JP H032673U
- Authority
- JP
- Japan
- Prior art keywords
- overglass
- component land
- conductor pattern
- component
- exposes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の原理図、第２図は本考案の実
施例の平面図、第３図は従来のＨＩＣ基板の説明
図、第４図は従来の改善策の説明図、第５図はパ
ターン切断部の平面図である。
図中、１はセラミツク基板、２は導体パターン
、３は部品ランド、４はオーバガラス、５は部品
、６は部品リード、７は半田、１０はオーバガラ
スの窓である。
Fig. 1 is a diagram of the principle of the present invention, Fig. 2 is a plan view of an embodiment of the invention, Fig. 3 is an explanatory diagram of a conventional HIC board, Fig. 4 is an explanatory diagram of a conventional improvement measure, and Fig. 5 is a plan view of a pattern cutting section. In the figure, 1 is a ceramic substrate, 2 is a conductor pattern, 3 is a component land, 4 is an overglass, 5 is a component, 6 is a component lead, 7 is solder, and 10 is a window of the overglass.
Claims (1)
品ランド３を形成し、その表面をオーバガラス４
でカバーする混成集積回路用基板において、 該オーバガラス４に該部品ランド３の一部だけ
を露出させる半田付け用の窓１０を形成してなる
ことを特徴とする混成集積回路用基板。[Claims for Utility Model Registration] A conductor pattern 2 and a component land 3 are formed on the surface of an insulating substrate 1, and the surface is covered with an overglass 4.
A hybrid integrated circuit board comprising: a soldering window 10 that exposes only a part of the component land 3 in the overglass 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6303989U JPH032673U (en) | 1989-05-31 | 1989-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6303989U JPH032673U (en) | 1989-05-31 | 1989-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032673U true JPH032673U (en) | 1991-01-11 |
Family
ID=31592737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6303989U Pending JPH032673U (en) | 1989-05-31 | 1989-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032673U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61296795A (en) * | 1985-06-26 | 1986-12-27 | 沖電気工業株式会社 | Thick film circuit pattern |
| JPS63177582A (en) * | 1987-01-19 | 1988-07-21 | 太陽誘電株式会社 | Manufacture of hybrid integrated circuit device |
| JPS63261789A (en) * | 1987-04-20 | 1988-10-28 | 株式会社日立製作所 | Glass ceramic circuit substrate |
-
1989
- 1989-05-31 JP JP6303989U patent/JPH032673U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61296795A (en) * | 1985-06-26 | 1986-12-27 | 沖電気工業株式会社 | Thick film circuit pattern |
| JPS63177582A (en) * | 1987-01-19 | 1988-07-21 | 太陽誘電株式会社 | Manufacture of hybrid integrated circuit device |
| JPS63261789A (en) * | 1987-04-20 | 1988-10-28 | 株式会社日立製作所 | Glass ceramic circuit substrate |